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NXP SEMICONDUCTORS EXPANDS COLLABORATION WITH MICROSOFT FOR IOT REAL-TIME OPERATION SYSTEM

NXP Semiconductors | May 05, 2020

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NXP and Microsoft hope that this collaboration will reduce production costs for developers and help them bring new industrial and IoT edge applications to market faster. As a provider of secure connectivity solutions for embedded applicatio...

Read More

Devices

AERIS PROVIDES DIRECT, PRIVATE CONNECTION BETWEEN AERIS FUSION IOT NETWORK AND AWS CLOUD INSTANCE

Aeris | November 12, 2020

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Secure, solid exchange of information from IoT devices to a cloud environment is a raising issue as organizations keep on scaling complex IoT solutions. To give a basic, affordable and compelling arrangement, Aeris, an IoT innovation pioneer, today presented Aeris Cloud Connect, which gives an immediate, private connection between the Aeris Fusion IoT Network and every client's AWS cloud instance. Cloud Connect utilizes a fundamental MPLS (multi-convention name exchanging) con...

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Enterprise Iot

BREAKTHROUGH NXM AUTONOMOUS SECURITY TECHNOLOGY PROTECTS SPACE INFRASTRUCTURE AND IOT DEVICES FROM CYBERATTACKS

DED BY | July 04, 2022

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NXM Labs, Inc., a leader in advanced cybersecurity software for connected devices, today unveiled its NXM Autonomous Security™platform that prevents hackers from gaining unauthorized access to commercial, industrial, medical, or consumer internet of things (IoT) devices. Tested in collaboration with the Jet Propulsion Laboratory (JPL), California Institute of Technology (Caltech), NXM successfully demonstrated the ability of its ground-breaking technology to enable future Mars rovers to au...

Read More

Industrial IoT

WINBOND AND INFINEON TECHNOLOGIES DOUBLE IOT BANDWIDTH WITH HYPERRAM 3.0

Winbond | April 20, 2022

news image

Winbond Electronics Corporation and Infineon Technologies, a worldwide leader in semiconductor, microelectronics, and IoT solutions, have announced the extension of their HYPERRAM product partnership with the new greater bandwidth HYPERRAM 3.0. As a leading provider of memory solutions, Infineon provides a family of solutions that deliver high performance in smaller form factors for next-generation IoT applications. HYPERRAM™ 3.0 is the third generation of the ...

Read More
news image

NXP SEMICONDUCTORS EXPANDS COLLABORATION WITH MICROSOFT FOR IOT REAL-TIME OPERATION SYSTEM

NXP Semiconductors | May 05, 2020

NXP and Microsoft hope that this collaboration will reduce production costs for developers and help them bring new industrial and IoT edge applications to market faster. As a provider of secure connectivity solutions for embedded applicatio...

Read More
news image

Devices

AERIS PROVIDES DIRECT, PRIVATE CONNECTION BETWEEN AERIS FUSION IOT NETWORK AND AWS CLOUD INSTANCE

Aeris | November 12, 2020

Secure, solid exchange of information from IoT devices to a cloud environment is a raising issue as organizations keep on scaling complex IoT solutions. To give a basic, affordable and compelling arrangement, Aeris, an IoT innovation pioneer, today presented Aeris Cloud Connect, which gives an immediate, private connection between the Aeris Fusion IoT Network and every client's AWS cloud instance. Cloud Connect utilizes a fundamental MPLS (multi-convention name exchanging) con...

Read More
news image

Enterprise Iot

BREAKTHROUGH NXM AUTONOMOUS SECURITY TECHNOLOGY PROTECTS SPACE INFRASTRUCTURE AND IOT DEVICES FROM CYBERATTACKS

DED BY | July 04, 2022

NXM Labs, Inc., a leader in advanced cybersecurity software for connected devices, today unveiled its NXM Autonomous Security™platform that prevents hackers from gaining unauthorized access to commercial, industrial, medical, or consumer internet of things (IoT) devices. Tested in collaboration with the Jet Propulsion Laboratory (JPL), California Institute of Technology (Caltech), NXM successfully demonstrated the ability of its ground-breaking technology to enable future Mars rovers to au...

Read More
news image

Industrial IoT

WINBOND AND INFINEON TECHNOLOGIES DOUBLE IOT BANDWIDTH WITH HYPERRAM 3.0

Winbond | April 20, 2022

Winbond Electronics Corporation and Infineon Technologies, a worldwide leader in semiconductor, microelectronics, and IoT solutions, have announced the extension of their HYPERRAM product partnership with the new greater bandwidth HYPERRAM 3.0. As a leading provider of memory solutions, Infineon provides a family of solutions that deliver high performance in smaller form factors for next-generation IoT applications. HYPERRAM™ 3.0 is the third generation of the ...

Read More

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C-Suite On Deck

Responsive image

Feature market insights and perspectives from top C-Level executives, elite technology influencers and thought leaders from your company here. This signature initiative has garnered immense support...

Contact Us