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Boingo Wireless | February 28, 2022
Boingo Wireless, a total connectivity provider of distributed antenna systems (DAS), Wi-Fi and private networks, today announced ahead of Mobile World Congress Barcelona that it is collaborating with Qualcomm Technologies, Inc and the Qualcomm® Smart Cities Accelerator Program ecosystem to streamline the deployment of IoT devices for venue and enterprise customers. Using the Qualcomm IoT Services Suite, Boingo can bring together the hardware, software and platforms required to enable IoT pro...
UVDI | June 14, 2022
UVDI is delighted to confirm the next generation UVDI-360 Room Sanitizer at the Association for Professionals in Infection Control and Epidemiology (APIC) Conference, which is now integrated with UV Smart Connect cloud communications technology, making it even easier and more efficient to use. Over 1,100 hospitals around the world rely on the new UVDI-360 for its independently validated effectiveness and user safety features.
With automatic, real-time Smart Device communications, ...
IoT Business News | March 16, 2020
With the increasing commercial use of 5G networks by global carriers, many 5G application scenarios are being realized. Among them, indoor network service is an application scenario in which consumers directly use 5G.General carriers traditionally provide users with wired broadband service through a telephone wire, optical fiber, coaxial cable or other media. However, it is impossible to provide high-quality network bandwidth services in some regions due to various reasons, such as inadequate in...
Winbond | April 20, 2022
Winbond Electronics Corporation and Infineon Technologies, a worldwide leader in semiconductor, microelectronics, and IoT solutions, have announced the extension of their HYPERRAM product partnership with the new greater bandwidth HYPERRAM 3.0.
As a leading provider of memory solutions, Infineon provides a family of solutions that deliver high performance in smaller form factors for next-generation IoT applications. HYPERRAM™ 3.0 is the third generation of the ...
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