Enterprise Iot
PR Newswire | October 06, 2023
Lexmark, a global imaging and IoT solutions leader, today announced it has again been named a leader in Managed Print Services (MPS) by global print and market insight research firm Quocirca. This is the 11th consecutive year in which Lexmark has earned this recognition.
In its Managed Print Services Market Landscape 2023 report, Quocirca highlights Lexmark's industry expertise, deep sustainability focus, and comprehensive security approach. It also recognizes Lexmark's small and medium businesses (SMB) MPS offering which was expanded in February 2023 with the launch of MPS Express, a solution for SMBs to streamline their document management processes and free them from day-to-day printer management.
Quocirca Director Louella Fernandes said, "Lexmark has a strong heritage in global MPS delivery, particularly excelling in supporting distributed print environments. Its deep vertical industry expertise, mature sustainability focus and comprehensive security approach differentiate Lexmark and ensure its position as an industry leader."
In naming Lexmark a market leader, the report recognizes Lexmark's:
Mature predictive analytics expertise which leverages artificial intelligence and machine learning technologies to support its sensor monitoring and predictive algorithms.
Security-led MPS approach which goes beyond the device, providing customers with a deep understanding of print network security.
Smart Refresh lifecycle management program, which uses performance and usage data to reduce waste by only replacing printers and MFPs at the end of their lifecycle.
Portfolio of cloud solutions and services, including Cloud Bridge technology which enables many devices and fleet environments to simply, securely and flexibly connect to Lexmark cloud infrastructure.
Workflow automation partnerships which form the Lexmark MPS alliance ecosystem, enabling customers to leverage solutions to simplify device management and streamline productivity and output environment from a single source.
Recently expanded MPS offerings for the SMB market.
Quocirca reports that MPS customers expect strong expertise across cybersecurity, cloud offerings and sustainability, and finds Lexmark well positioned to provide all three. Being recognized once again as a global MPS leader by Quocirca validates our efforts to provide our customers with industry leading technologies and services, said Melanie Hudson, Senior Vice President and Chief Commercial Officer, Lexmark.
This year Quocirca has also recognized Lexmark as a leader in its Global Print Security Vendor Landscape report and Cloud Print Services Market Landscape.
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Industrial IoT
Business Wire | September 29, 2023
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard. The Integrity 3D-IC Platform is fully compliant with the 3Dblox 2.0 standard language extensions, and the flows have been optimized for all of TSMC’s latest 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS®) and System-on-Integrated-Chips (TSMC-SoIC®) technologies. Through this latest collaboration between Cadence and TSMC, customers creating AI, mobile, 5G, hyperscale computing and IoT 3D-IC designs can model system prototypes to accelerate design turnaround time.
Prototyping requires two different types of feasibility-checking methods across the various 3DFabric technologies—coarse-grained feasibility for thermal and EM-IR analysis, and fine-grained feasibility for die-to-die connections. Coarse-grained feasibility is enabled through a system-level tool integration with the Integrity 3D-IC Platform, featuring Voltus™ IC Power Integrity Solution and Celsius™ Thermal Solver, providing seamless prototyping for all TSMC’s latest 3DFabric configurations. Fine-grained feasibility is enabled through a silicon routing solution as well as joint collaboration on the development of a next-generation auto-router for 3DFabric technologies, which includes performance-boosting prototyping capabilities that support TSMC’s InFO and CoWoS offerings, enabled through the Integrity 3D-IC platform.
The Integrity 3D-IC platform is certified for use with TSMC’s 3DFabric and the 3Dblox 2.0 specification. The platform combines system planning, implementation and system-level analysis in a single platform, and due to the shared infrastructure between Cadence 3D design and system analysis tools, customers can perform feasibility-checking much more efficiently. In addition, Cadence Allegro® X packaging solutions have been enhanced with advanced InFO-specific design rule checking (DRC).
The flows supporting the 3Dblox 2.0 standard provide chiplet mirroring, which lets engineers reuse chiplet module data, improving productivity and performance. In addition, the flows provide inter-chiplet DRC through the Cadence Pegasus™ Verification System, which helps designers create an inter-chiplet CAD layer for DRC automatically.
With multiple packaging options available for implementation of multi-die designs, early prototyping and feasibility studies are becoming increasingly important, said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. Through our continued collaboration with Cadence and with the addition of the latest prototyping features that support the 3Dblox 2.0 standard, we’re enabling customers to leverage our comprehensive 3DFabric technologies and the Cadence flows to significantly improve 3D-IC design productivity and time to market.
“The Cadence Integrity 3D-IC Platform is the unified solution that provides an efficient way for customers to leverage the new 3Dblox 2.0 prototyping capabilities to create leading-edge 3D-IC designs using TSMC’s 3DFabric technologies,” said Dr. Chin-Chi Teng, senior vice president and general manager in the Digital & Signoff Group at Cadence. “By working closely with TSMC, customers adopting our new flows for use with 3Dblox 2.0 standard can accelerate the pace of innovation with next-generation multi-chiplet designs.”
The Cadence Integrity 3D-IC Platform includes Allegro X packaging technologies and is part of the company’s broader 3D-IC offering. The offering aligns with the Cadence Intelligent System Design™ strategy, enabling customers to achieve system-in-package (SiP) design excellence. For more information on the Integrity 3D-IC platform, please visit www.cadence.com/go/integrity3dblox2.
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Industrial IoT
Business Wire | October 23, 2023
Comcast and Broadcom today announced joint efforts to develop the world’s first AI-powered access network with a new chipset that embeds artificial intelligence (AI) and machine learning (ML) within the nodes, amps and modems that comprise the last few miles of Comcast’s network. With these new capabilities broadly deployed throughout the network, Comcast will be able to transform its operations by automating more network functions and deliver an improved customer experience through better and more actionable intelligence.
Additionally, the new chipset will be the first in the world to incorporate DOCSIS 4.0 Full Duplex (FDX), Extended Spectrum (ESD) and the ability to run both simultaneously, enabling Internet service providers across the globe to deliver DOCSIS 4.0 services using a toolkit with technology options to meet their business needs. DOCSIS 4.0 is the next-generation network technology that will introduce symmetrical multi-gigabit Internet speeds, lower latency, and even better security and reliability to hundreds of millions of people and businesses over their existing connections without the need for major construction of new network infrastructure.
On October 12, Comcast announced that it will begin to introduce the first customers in the world to Internet services powered by DOCSIS 4.0 using FDX. While the company will continue to leverage FDX, the collaboration with Broadcom will provide Comcast and other operators with additional options in the pursuit of delivering the best possible connectivity experience.
The Xfinity 10G Network leverages the latest advancements in edge compute, digital optics and real-time, actionable telemetry to meet and exceed our customers’ constantly evolving connectivity needs, said Elad Nafshi, Chief Network Officer, Comcast Cable. With this new Unified DOCSIS4 chipset from Broadcom, we can broadly deploy transformational AI network capabilities alongside symmetrical multi-gig speeds. FDX is the best technology for Comcast, but this groundbreaking unified chipset will provide the entire industry with options when upgrading their nodes, amps, and cable modems for DOCSIS 4.0.
The new end-to-end chipsets will be the industry’s first to incorporate AI and ML capabilities that will transform the operations and customer experience functions by:
Making smarter network performance decisions using network diagnostics insights produced by both local and cloud AI.
Enhanced monitoring and issue detection using bandwidth-efficient telemetry data.
Transforming network maintenance of the network using real time issue localization plus predictive and self-healing network intelligence.
Protecting network facilities and customers with improved cybersecurity intrusion detection.
Assisting customers more effectively through local and cloud-based AI.
Monitoring home IoT devices for connectivity disruptions.
All these capabilities, and more, are achieved while reducing network latency and insulating customer data to ensure the utmost privacy standards.
“By enabling a toolkit that includes FDX, ESD or both simultaneously, this new Unified DOCSIS4 chipset incorporates the advantages of both technologies and will enable economies of scale as well as a common retail modem for the industry,” said Rich Nelson, Senior Vice President and General Manager, Broadband Video Group, Broadcom. “The edge network and in-home capabilities of this chipset will improve network intelligence and reliability to create an improved broadband experience with enhanced privacy protection and cyber security for the consumer.”
Comcast and Broadcom are designing and building the new chipset based upon CableLabs’ DOCSIS 4.0 specifications. The companies have a history of working together to introduce innovations that have pushed the industry to the next generation of connectivity. In 2021, Comcast conducted the world’s first full duplex multi-gigabit symmetrical test on Broadcom-built silicon. In January 2022 the companies tested the first Full Duplex DOCSIS 4.0 system-on-chip (SoC) cable modem that delivered symmetrical speeds faster than 4 Gbps. Later that year, Comcast successfully tested the final technical component of necessary to deliver multi-gig symmetrical speed powered by DOCSIS 4.0 throughout its network with 10G smart amps built on a Broadcom-developed reference design.
The companies expect to begin trials early in 2024 and to begin deploying the new chipset in live networks before the end of the same year.
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