Devices, Security

CEVA Joins Samsung SAFE™ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets

ceva-joins-samsung-safe-

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and custom SoC solutions, today announced that it has joined the Samsung Advanced Foundry Ecosystem (SAFE™) to streamline chip design and accelerate time-to-market for CEVA licensees using Samsung's advanced foundry processes.

Samsung Foundry is offering competitive processes, design technologies, IP, and high-volume manufacturing capability for customers. The full suite of advanced process technologies includes 28FD-SOI, 14/10/8/5/4nm FinFet, and 3nm GAA with EUV technology from 5nm. CEVA's IPs are already in production at Samsung's foundries in multiple process technologies for a wide range of end markets, including 5G infrastructure, automotive, surveillance and consumer electronics. The collaboration further aims to reduce supply chain risks by expanding the advanced manufacturing process options available to CEVA customers, certifying CEVA's industry-leading wireless connectivity and sensing AI IPs for Samsung's foundry offerings to enable seamless integration into chip and chiplet designs.

"Our collaboration with Samsung Foundry through the SAFE™ program brings together a world-leading foundry service and one of the most widely used silicon IP suppliers, to help ensure faster silicon success for our customers in the AI era," said Moshe Sheier, Vice President of Marketing at CEVA. "Our IPs for 5G, Wi-Fi, DSP and generative AI at the edge are experiencing exceptional demand globally, and through this partnership we can help drive the proliferation of intelligent connected devices that leverage our industry-leading power efficiency and performance capabilities and Samsung's state-of-the-art foundry process technologies."

The Samsung SAFE™ IP Partner Program is the key part of Samsung Advanced Foundry Ecosystem (SAFE™) aiming to create a strong ecosystem between Samsung Foundry and IP partners, to provide diverse IP portfolios in various application fields, based on customer's requirements. The portfolio consists of dedicated as well as foundation IPs designed for performance-intensive applications.  For more information, visit https://semiconductor.samsung.com/us/foundry/safe/ip/

CEVA's industry-leading wireless connectivity and sensing AI IPs power billions of devices around the world, spanning a diverse range of end markets, including, mobile, consumer IoT, PCs, infrastructure and industrial. 

About CEVA, Inc.

CEVA is the leading licensor of wireless connectivity and smart sensing technologies and custom SoC solutions for a smarter, safer, connected world. We provide Digital Signal Processors, AI engines, wireless platforms, cryptography cores and complementary embedded software for sensor fusion, image enhancement, computer vision, spatial audio, voice input and artificial intelligence. These technologies are offered in combination with our Intrinsix IP integration services, helping our customers address their most complex and time-critical integrated circuit design projects. Leveraging our technologies and chip design skills, many of the world's leading semiconductors, system companies and OEMs create power-efficient, intelligent, secure and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial, aerospace & defense and IoT.

Spotlight

Spotlight

Related News

Industrial IoT

Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows

Business Wire | September 29, 2023

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard. The Integrity 3D-IC Platform is fully compliant with the 3Dblox 2.0 standard language extensions, and the flows have been optimized for all of TSMC’s latest 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS®) and System-on-Integrated-Chips (TSMC-SoIC®) technologies. Through this latest collaboration between Cadence and TSMC, customers creating AI, mobile, 5G, hyperscale computing and IoT 3D-IC designs can model system prototypes to accelerate design turnaround time. Prototyping requires two different types of feasibility-checking methods across the various 3DFabric technologies—coarse-grained feasibility for thermal and EM-IR analysis, and fine-grained feasibility for die-to-die connections. Coarse-grained feasibility is enabled through a system-level tool integration with the Integrity 3D-IC Platform, featuring Voltus™ IC Power Integrity Solution and Celsius™ Thermal Solver, providing seamless prototyping for all TSMC’s latest 3DFabric configurations. Fine-grained feasibility is enabled through a silicon routing solution as well as joint collaboration on the development of a next-generation auto-router for 3DFabric technologies, which includes performance-boosting prototyping capabilities that support TSMC’s InFO and CoWoS offerings, enabled through the Integrity 3D-IC platform. The Integrity 3D-IC platform is certified for use with TSMC’s 3DFabric and the 3Dblox 2.0 specification. The platform combines system planning, implementation and system-level analysis in a single platform, and due to the shared infrastructure between Cadence 3D design and system analysis tools, customers can perform feasibility-checking much more efficiently. In addition, Cadence Allegro® X packaging solutions have been enhanced with advanced InFO-specific design rule checking (DRC). The flows supporting the 3Dblox 2.0 standard provide chiplet mirroring, which lets engineers reuse chiplet module data, improving productivity and performance. In addition, the flows provide inter-chiplet DRC through the Cadence Pegasus™ Verification System, which helps designers create an inter-chiplet CAD layer for DRC automatically. With multiple packaging options available for implementation of multi-die designs, early prototyping and feasibility studies are becoming increasingly important, said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. Through our continued collaboration with Cadence and with the addition of the latest prototyping features that support the 3Dblox 2.0 standard, we’re enabling customers to leverage our comprehensive 3DFabric technologies and the Cadence flows to significantly improve 3D-IC design productivity and time to market. “The Cadence Integrity 3D-IC Platform is the unified solution that provides an efficient way for customers to leverage the new 3Dblox 2.0 prototyping capabilities to create leading-edge 3D-IC designs using TSMC’s 3DFabric technologies,” said Dr. Chin-Chi Teng, senior vice president and general manager in the Digital & Signoff Group at Cadence. “By working closely with TSMC, customers adopting our new flows for use with 3Dblox 2.0 standard can accelerate the pace of innovation with next-generation multi-chiplet designs.” The Cadence Integrity 3D-IC Platform includes Allegro X packaging technologies and is part of the company’s broader 3D-IC offering. The offering aligns with the Cadence Intelligent System Design™ strategy, enabling customers to achieve system-in-package (SiP) design excellence. For more information on the Integrity 3D-IC platform, please visit www.cadence.com/go/integrity3dblox2.

Read More

IoT Security

8 Vulnerabilities in OAS Platform for IoT Data, Detected by Cisco

Cisco | September 14, 2023

Cisco disclosed eight vulnerabilities in the OAS platform’s engine configuration management functionality. Three of the eight detected vulnerabilities were rated as high-severity. The issues detected in OAS platform v18.00.0072 were addressed and, v19 was released. Cisco's Talos security researchers have identified eight vulnerabilities in the Open Automation Software (OAS) Platform that can be exploited to bypass authentication, disclose sensitive information, and overwrite files. The OAS Platform is commonly used to facilitate communication and data transfer between servers, industrial control systems (ICS), IoT devices, and other hardware in industrial and enterprise settings. The OAS Platform is widely deployed in industrial operations, enterprise environments, and cross-platform integrations. It plays a crucial role in facilitating communication and data exchange across various devices and systems, facilitating logging and notifications. The vulnerabilities pose a significant security risk, especially in environments where the OAS Platform is used for critical industrial and enterprise operations. Unauthorized access and data breaches can lead to operational disruptions and potentially compromise sensitive information. Among the eight vulnerabilities, three are rated as high-severity. Cisco's Talos security researchers were responsible for discovering and disclosing these vulnerabilities. The most critical issues are CVE-2023-31242 and CVE-2023-34998, both of which are authentication bypass flaws. CVE-2023-31242 can be triggered through a sequence of requests, while CVE-2023-34998 can be exploited by sniffing network traffic. The identified vulnerabilities in the OAS Platform mainly revolve around authentication bypass, information disclosure, and file manipulation. Attackers could leverage these weaknesses to create new users, gain unauthorized access, decrypt sensitive information, and perform arbitrary file and directory actions. These vulnerabilities essentially allow attackers to gain unauthorized access to the system by loading and saving configurations to a disk and installing them on other devices. The issues were identified in OAS Platform version 18 and have been addressed in the subsequent release, version 19.00.0000, highlighting the importance of keeping software up-to-date to mitigate security risks. These issues stem from the fact that when the OAS engine is deployed, by default, no admin user is defined and no authentication is required to access functionality such as new user creation. Even if an admin user is created, the configuration must be stored prior to restarting the engine, or it will revert to its default state. An attacker can create a new user, save the changes, and thus gain access to the underlying system. Also, the vulnerability enables an attacker to acquire a protobuf containing valid admin credentials and construct their own requests. The perpetrator could then again obtain access to the underlying system by utilizing the user creation and saving functionality. Cisco warns that these authentication bypass flaws could be combined with CVE-2023-34317, an improper input validation flaw in the user creation functionality, to gain access to the underlying system by adding ‘a user with the username field containing an SSH key.’ CVE-2023-34353 is another high-severity authentication bypass that allows an attacker to perform network snooping to acquire the protobuf containing admin credentials and then decrypt sensitive information. While two of the remaining vulnerabilities could result in information disclosure, the other two could be exploited to create or overwrite arbitrary files and create arbitrary directories.

Read More

Industrial IoT

Comcast and Broadcom to Develop the World’s First AI-Powered Access Network With Pioneering New Chipset

Business Wire | October 23, 2023

Comcast and Broadcom today announced joint efforts to develop the world’s first AI-powered access network with a new chipset that embeds artificial intelligence (AI) and machine learning (ML) within the nodes, amps and modems that comprise the last few miles of Comcast’s network. With these new capabilities broadly deployed throughout the network, Comcast will be able to transform its operations by automating more network functions and deliver an improved customer experience through better and more actionable intelligence. Additionally, the new chipset will be the first in the world to incorporate DOCSIS 4.0 Full Duplex (FDX), Extended Spectrum (ESD) and the ability to run both simultaneously, enabling Internet service providers across the globe to deliver DOCSIS 4.0 services using a toolkit with technology options to meet their business needs. DOCSIS 4.0 is the next-generation network technology that will introduce symmetrical multi-gigabit Internet speeds, lower latency, and even better security and reliability to hundreds of millions of people and businesses over their existing connections without the need for major construction of new network infrastructure. On October 12, Comcast announced that it will begin to introduce the first customers in the world to Internet services powered by DOCSIS 4.0 using FDX. While the company will continue to leverage FDX, the collaboration with Broadcom will provide Comcast and other operators with additional options in the pursuit of delivering the best possible connectivity experience. The Xfinity 10G Network leverages the latest advancements in edge compute, digital optics and real-time, actionable telemetry to meet and exceed our customers’ constantly evolving connectivity needs, said Elad Nafshi, Chief Network Officer, Comcast Cable. With this new Unified DOCSIS4 chipset from Broadcom, we can broadly deploy transformational AI network capabilities alongside symmetrical multi-gig speeds. FDX is the best technology for Comcast, but this groundbreaking unified chipset will provide the entire industry with options when upgrading their nodes, amps, and cable modems for DOCSIS 4.0. The new end-to-end chipsets will be the industry’s first to incorporate AI and ML capabilities that will transform the operations and customer experience functions by: Making smarter network performance decisions using network diagnostics insights produced by both local and cloud AI. Enhanced monitoring and issue detection using bandwidth-efficient telemetry data. Transforming network maintenance of the network using real time issue localization plus predictive and self-healing network intelligence. Protecting network facilities and customers with improved cybersecurity intrusion detection. Assisting customers more effectively through local and cloud-based AI. Monitoring home IoT devices for connectivity disruptions. All these capabilities, and more, are achieved while reducing network latency and insulating customer data to ensure the utmost privacy standards. “By enabling a toolkit that includes FDX, ESD or both simultaneously, this new Unified DOCSIS4 chipset incorporates the advantages of both technologies and will enable economies of scale as well as a common retail modem for the industry,” said Rich Nelson, Senior Vice President and General Manager, Broadband Video Group, Broadcom. “The edge network and in-home capabilities of this chipset will improve network intelligence and reliability to create an improved broadband experience with enhanced privacy protection and cyber security for the consumer.” Comcast and Broadcom are designing and building the new chipset based upon CableLabs’ DOCSIS 4.0 specifications. The companies have a history of working together to introduce innovations that have pushed the industry to the next generation of connectivity. In 2021, Comcast conducted the world’s first full duplex multi-gigabit symmetrical test on Broadcom-built silicon. In January 2022 the companies tested the first Full Duplex DOCSIS 4.0 system-on-chip (SoC) cable modem that delivered symmetrical speeds faster than 4 Gbps. Later that year, Comcast successfully tested the final technical component of necessary to deliver multi-gig symmetrical speed powered by DOCSIS 4.0 throughout its network with 10G smart amps built on a Broadcom-developed reference design. The companies expect to begin trials early in 2024 and to begin deploying the new chipset in live networks before the end of the same year.

Read More