Enterprise Iot, Devices

Hologram's eUICC SIM Offers Network Fallback for IoT Devices

holograms-euicc-sim

Hologram, the industry-leading cellular connectivity platform for the Internet of Things, has introduced the next-generation Hyper SIM with network fallback functionality. The global eUICC SIM integrates directly with leading carriers in the United States and Canada, enabling network fallback to maintain device connectivity intelligently.

While millions of IoT devices utilize global roaming agreements for cost-effective global access, increasing international connectivity restrictions and specific IoT connectivity requirements, traditional SIMs with roaming profiles no longer suffice for IoT. Next-gen Hyper SIM provides direct access to carriers in the US and Canada, ensuring operator-guaranteed connectivity for global IoT deployments. With native profiles, Hyper SIM provides high-performance IoT connectivity for industrial robotics, video streaming, autonomous drones, and more.

In addition to performance, IoT applications such as payment processing, security monitoring, and micromobility, among others, require continuous connectivity resistant to network failures. Therefore, the next-generation Hyper SIM incorporates network fallback, an intelligent profile management agent that switches eUICC profiles automatically when native connectivity is unavailable.

With network fallback, Hyper SIMs can connect to high-performance native profiles as their primary connectivity source without compromising the advantages of multi-carrier and route redundancy provided by global roaming profiles.

Ben Forgan, Co-Founder and CEO of Hologram, shared, "When we launched Hyper in 2020, we turned connectivity into software, offering the first eUICC IoT global SIM." He added, "We're bringing that innovation to the next level to address the needs of the sophisticated IoT applications we're seeing today. Whether streaming video or autonomous drones, the next generation of Hyper gives connected devices the low latency delivered from native performance with the reliability and flexibility of global roaming they now require."

(Source – Cision PR Newswire)

About Hologram

Hologram empowers innovators worldwide to build the future. The company provides cellular connectivity, software, and support to connect and manage IoT devices anywhere in the world. With its Hyper IoT SIM cards, IoT devices enjoy superior performance backed by eUICC technology designed to last the lifetime of deployments. The company's streamlined tools allow teams to make data-driven decisions and manage operations easily. Its dashboard shows device performance, manages spend, and equips teams for the future, all in one place.

Spotlight

Spotlight

Related News

Enterprise Iot

GlobalFoundries® and Microchip Announce Microchip’s 28-nm SuperFlash® Embedded Flash Memory Solution in Production

GlobeNewswire | October 04, 2023

GlobalFoundries (GF®) (Nasdaq: GFS) and Microchip Technology (Nasdaq: MCHP), via Microchip’s Silicon Storage Technology® (SST®) subsidiary, today announces the immediate release to production of the SST ESF3 third-generation embedded SuperFlash technology NVM solution in the GF 28SLPe foundry process. GF has established a new industry benchmark for implementing SST’s widely deployed ESF3 SuperFlash technology. This implementation delivers the following capabilities and benefits: Lowest cost 28-nm HKMG ESF3 solution with only 10 masks added, including true 5V IO CMOS devices Highly competitive SST ESF3 bit cell size of less than 0.05 micron squared Operating temperature rating of −40°C to 125°C Sub-25 nanosecond (ns) read access times, 10-microsecond program times and four millisecond erase times Endurance exceeding 100,000 program/erase cycles No impact to design flows using GF 28SLPe platform-qualified IP (EG flow) Immediate availability of off-the-shelf macros from four megabits (Mb) to 32 Mb Access to custom macro design support from SST or GF Use cases for embedded flash are exploding with the drive for increased intelligence at the edge. Embedded memory for secure code storage, over-the-air-updates and enhanced functionality is on the rise in a wide range of applications in home and industrial IoT as well as smart mobile devices. Innovative platforms are required to meet these needs. GF is proud to partner with SST to develop, qualify and release to production this impressive embedded NVM solution on our robust 28SLPe platform, said Mike Hogan, chief business unit officer at GF. GF’s customers are finding this combination of high performance, excellent reliability, IP availability and cost effectiveness to be ideal for advanced MCUs, complex smart cards and IoT chips for consumer and industrial products. “SST and GF have partnered closely over the last decade to integrate and productize SST’s industry-standard ESF1 and ESF3 embedded Flash technologies into GF’s 130-nm BCD, 55-nm, 40-nm, and now 28-nm foundry platforms,” added Mark Reiten, vice president of SST, Microchip’s licensing business unit. “We are excited by the leadership position GF is establishing for the broadest offering of embedded NVM solutions and expect our close partnership to deliver additional breakthroughs over the coming decade.” SST is exhibiting its embedded Flash technology in the IP partner area during today’s GF GTS Summit in Munich. Customers interested in GF’s ESF1 and ESF3 platform solutions should access the GF website located at www.gf.com/technology-platforms and contact the company for more information at www.gf.com/about-us/contact-us. Customers interested in SST’s ESF1, ESF3 or SuperFlash® technology memBrain™ neuromorphic memory solution IP offerings should contact info@sst.com or the appropriate regional contact listed on the SST website.

Read More

Enterprise Iot

Tavant Unveils Data Beats™: A Data-Driven Ecosystem Built for Fintechs and Financial Institutions to Harness Data Insights

Business Wire | October 20, 2023

Tavant, Silicon Valley’s leading digital lending solutions provider, today announced at the MBA's Annual Convention & Expo in Philadelphia, the launch of Data Beats™, a groundbreaking data platform that promises to redefine the financial services landscape. Built to inform, provide insights, act, recommend, and predict, Data Beats ushers in a new era of data-driven intelligence for the industry. This versatile platform empowers businesses to harness the power of their data and maximize its value, effectively taking the stress out of data management. Key benefits of Data Beats include: Provides actionable data insights that work for your business; Analyzes data from various aspects of your operations; Adapts and learns from your data to provide real-time recommendations; and Looks into the future, learns and predicts trends. Data Beats is a platform offering within Tavant's banking and financial services suite of technology products. Data Beats is set to serve as the analytics and IoT engine for the financial services industry, initially focusing on mortgage and home equity products. Tavant plans to extend this robust data ecosystem to all consumer loans and banking products, making it a comprehensive solution for financial institutions. With Data Beats, Tavant empowers financial institutions towards proactive rather than reactive operations by incorporating generative AI to prompt users on the best course of action. This revolutionary approach allows the platform to offer precise recommendations for loan officers, consumers, processors, and underwriters, enhancing the overall efficiency of the lending process. Abhinav Asthana, Fintech Product Business and Growth Leader at Tavant said, Tavant's mission is to stay at the forefront of innovation and to be the engineering partner of choice in the financial services industry. Data Beats exemplifies our commitment to providing our customers with an advanced platform that accelerates their vision to transform into a data-first organization. We are proud to launch this platform, which brings insights, intelligence, and efficiency to the heart of the lending process. Data Beats has already started demonstrating its value within Tavant's existing customer base by enhancing and automating the home buying experience. By consolidating data from various stages of the customer journey, from acquisition to servicing and beyond, Data Beats provides invaluable insights that can be used to predict future behavior, optimize operations, and improve overall business performance. The system's foundation, the data lake, can ingest a wide range of data inputs, limited only by the specific business problem it aims to solve. This flexibility positions Data Beats to become a game-changing tool for a wide range of industries beyond mortgage and lending.

Read More

Industrial IoT

Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows

Business Wire | September 29, 2023

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard. The Integrity 3D-IC Platform is fully compliant with the 3Dblox 2.0 standard language extensions, and the flows have been optimized for all of TSMC’s latest 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS®) and System-on-Integrated-Chips (TSMC-SoIC®) technologies. Through this latest collaboration between Cadence and TSMC, customers creating AI, mobile, 5G, hyperscale computing and IoT 3D-IC designs can model system prototypes to accelerate design turnaround time. Prototyping requires two different types of feasibility-checking methods across the various 3DFabric technologies—coarse-grained feasibility for thermal and EM-IR analysis, and fine-grained feasibility for die-to-die connections. Coarse-grained feasibility is enabled through a system-level tool integration with the Integrity 3D-IC Platform, featuring Voltus™ IC Power Integrity Solution and Celsius™ Thermal Solver, providing seamless prototyping for all TSMC’s latest 3DFabric configurations. Fine-grained feasibility is enabled through a silicon routing solution as well as joint collaboration on the development of a next-generation auto-router for 3DFabric technologies, which includes performance-boosting prototyping capabilities that support TSMC’s InFO and CoWoS offerings, enabled through the Integrity 3D-IC platform. The Integrity 3D-IC platform is certified for use with TSMC’s 3DFabric and the 3Dblox 2.0 specification. The platform combines system planning, implementation and system-level analysis in a single platform, and due to the shared infrastructure between Cadence 3D design and system analysis tools, customers can perform feasibility-checking much more efficiently. In addition, Cadence Allegro® X packaging solutions have been enhanced with advanced InFO-specific design rule checking (DRC). The flows supporting the 3Dblox 2.0 standard provide chiplet mirroring, which lets engineers reuse chiplet module data, improving productivity and performance. In addition, the flows provide inter-chiplet DRC through the Cadence Pegasus™ Verification System, which helps designers create an inter-chiplet CAD layer for DRC automatically. With multiple packaging options available for implementation of multi-die designs, early prototyping and feasibility studies are becoming increasingly important, said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. Through our continued collaboration with Cadence and with the addition of the latest prototyping features that support the 3Dblox 2.0 standard, we’re enabling customers to leverage our comprehensive 3DFabric technologies and the Cadence flows to significantly improve 3D-IC design productivity and time to market. “The Cadence Integrity 3D-IC Platform is the unified solution that provides an efficient way for customers to leverage the new 3Dblox 2.0 prototyping capabilities to create leading-edge 3D-IC designs using TSMC’s 3DFabric technologies,” said Dr. Chin-Chi Teng, senior vice president and general manager in the Digital & Signoff Group at Cadence. “By working closely with TSMC, customers adopting our new flows for use with 3Dblox 2.0 standard can accelerate the pace of innovation with next-generation multi-chiplet designs.” The Cadence Integrity 3D-IC Platform includes Allegro X packaging technologies and is part of the company’s broader 3D-IC offering. The offering aligns with the Cadence Intelligent System Design™ strategy, enabling customers to achieve system-in-package (SiP) design excellence. For more information on the Integrity 3D-IC platform, please visit www.cadence.com/go/integrity3dblox2.

Read More