Business Wire | October 23, 2023
Comcast and Broadcom today announced joint efforts to develop the world’s first AI-powered access network with a new chipset that embeds artificial intelligence (AI) and machine learning (ML) within the nodes, amps and modems that comprise the last few miles of Comcast’s network. With these new capabilities broadly deployed throughout the network, Comcast will be able to transform its operations by automating more network functions and deliver an improved customer experience through better and more actionable intelligence.
Additionally, the new chipset will be the first in the world to incorporate DOCSIS 4.0 Full Duplex (FDX), Extended Spectrum (ESD) and the ability to run both simultaneously, enabling Internet service providers across the globe to deliver DOCSIS 4.0 services using a toolkit with technology options to meet their business needs. DOCSIS 4.0 is the next-generation network technology that will introduce symmetrical multi-gigabit Internet speeds, lower latency, and even better security and reliability to hundreds of millions of people and businesses over their existing connections without the need for major construction of new network infrastructure.
On October 12, Comcast announced that it will begin to introduce the first customers in the world to Internet services powered by DOCSIS 4.0 using FDX. While the company will continue to leverage FDX, the collaboration with Broadcom will provide Comcast and other operators with additional options in the pursuit of delivering the best possible connectivity experience.
The Xfinity 10G Network leverages the latest advancements in edge compute, digital optics and real-time, actionable telemetry to meet and exceed our customers’ constantly evolving connectivity needs, said Elad Nafshi, Chief Network Officer, Comcast Cable. With this new Unified DOCSIS4 chipset from Broadcom, we can broadly deploy transformational AI network capabilities alongside symmetrical multi-gig speeds. FDX is the best technology for Comcast, but this groundbreaking unified chipset will provide the entire industry with options when upgrading their nodes, amps, and cable modems for DOCSIS 4.0.
The new end-to-end chipsets will be the industry’s first to incorporate AI and ML capabilities that will transform the operations and customer experience functions by:
Making smarter network performance decisions using network diagnostics insights produced by both local and cloud AI.
Enhanced monitoring and issue detection using bandwidth-efficient telemetry data.
Transforming network maintenance of the network using real time issue localization plus predictive and self-healing network intelligence.
Protecting network facilities and customers with improved cybersecurity intrusion detection.
Assisting customers more effectively through local and cloud-based AI.
Monitoring home IoT devices for connectivity disruptions.
All these capabilities, and more, are achieved while reducing network latency and insulating customer data to ensure the utmost privacy standards.
“By enabling a toolkit that includes FDX, ESD or both simultaneously, this new Unified DOCSIS4 chipset incorporates the advantages of both technologies and will enable economies of scale as well as a common retail modem for the industry,” said Rich Nelson, Senior Vice President and General Manager, Broadband Video Group, Broadcom. “The edge network and in-home capabilities of this chipset will improve network intelligence and reliability to create an improved broadband experience with enhanced privacy protection and cyber security for the consumer.”
Comcast and Broadcom are designing and building the new chipset based upon CableLabs’ DOCSIS 4.0 specifications. The companies have a history of working together to introduce innovations that have pushed the industry to the next generation of connectivity. In 2021, Comcast conducted the world’s first full duplex multi-gigabit symmetrical test on Broadcom-built silicon. In January 2022 the companies tested the first Full Duplex DOCSIS 4.0 system-on-chip (SoC) cable modem that delivered symmetrical speeds faster than 4 Gbps. Later that year, Comcast successfully tested the final technical component of necessary to deliver multi-gig symmetrical speed powered by DOCSIS 4.0 throughout its network with 10G smart amps built on a Broadcom-developed reference design.
The companies expect to begin trials early in 2024 and to begin deploying the new chipset in live networks before the end of the same year.
Microchip Technology Inc. | October 09, 2023
Microchip Technology introduced nine new FPGA and SoC solution stacks designed for vertical markets.
These solution stacks enable rapid deployment of intelligent edge solutions without requiring specialized expertise.
Customers have praised PolarFire FPGAs for their small footprint, energy efficiency, and high performance.
Microchip Technology has introduced nine new FPGA and SoC solution stacks, each tailored to meet specific requirements in vertical markets such as industrial edge, smart embedded vision, and edge communications.
Microchip aims to simplify the creation of industrial and communications designs by offering solution stacks that leverage the power efficiency, security, and reliability of PolarFire FPGAs. Companies like Xenics and KAYA Instruments have cited benefits such as small form factor, power efficiency, and energy efficiency in utilizing Microchip's FPGA solution stacks for their products.
In addition to the launch of its industrial edge stack and related tools earlier this year for Open Platform Communications/Unified Architecture (OPC/UA)-based IIoT applications, this increases the total number of PolarFire and SoC solution stacks to ten.
For Smart Embedded Vision:
CoaXpress among others
For Industrial Edge:
For Edge Communications:
Small Form-factor pluggable optical module
Software-defined radios and others
Customers mentioned several factors for choosing Microchip's FPGA solution stacks. Federic Aubrun, Chief Commercial Officer (CCO) of Xenics, a developer of infrared imaging sensors with products for short-, mid-, and long-wave IR imagers, cores, and cameras, emphasized the significance of size, weight, and power considerations in thermal imaging system design. He stated that Microchip's SmartFusion and PolarFire FPGAs offered the optimal combination of a compact form factor, power efficiency, and processing capabilities while operating within a highly efficient power budget in their current and future product lines.
These solution stacks provide detailed IP, reference designs, development kits, application notes, and demo guides, enabling the deployment of intelligent edge solutions. It stacks cater to the growing demand for quick deployment of intelligent edge solutions without the need for specialized technology knowledge. The solution stacks cover various areas, including H.264 compression, HDMI, serial digital interface, CoaXpress, motor control, OPC/UA, software-defined radios, USXGMII, SFP+ optical modules, and 5G ORAN, providing versatile options for different vertical markets.
Another company, KAYA Instruments, designs industrial-grade imaging equipment, such as small-form-factor, low-power cameras and frame grabbers that deliver high-quality video under ordinary to extreme ambient light conditions.
Michael Yampolsky, Founder and CEO at KAYA, stated,
We use PolarFire FPGAs due to their compact footprint and energy efficiency. Utilizing the most up-to-date CMOS sensor technology, they enable cameras to fit in tight spaces while maintaining high quality, low noise, exceptional dynamic range, and a large feature set. FPGAs on our platform enables us to rapidly bring the most advanced vision technology to market to meet the needs of our customers.
MarketScreener | October 18, 2023
Nokia, together with BT Group and MediaTek today announced that they have successfully completed trials of 5G Reduced Capability (RedCap) technology with RedCap devices.
The trial, which took place at BT Group's Adastral Park site, utilized Nokia's AirScale RAN portfolio, EE's 5G Standalone (SA) network, and MediaTek's RedCap testing platform. RedCap is a technology introduced in 3GPP Release 17 that brings 5G to devices that do not require its full capabilities. It has the potential to expand the IoT ecosystem and accelerate its deployment within the industry. BT Group is evaluating RedCap to support new 5G use cases which could benefit both EE's business and consumer customer bases.
5G devices such as smartphones often have complex hardware and power-hungry features which leads to higher cost, size, and power consumption. RedCap technology focuses on simplifying 5G devices, particularly small IoT devices such as wearables or health trackers for consumers as well as ruggedized routers, and environmental or other condition-based monitoring sensors. These devices have less demand for battery life and lower bandwidth requirements. RedCap ensures they maintain performance and optimizes their power efficiency. Nokia has played a pivotal role in advancing RedCap IoT functionality together with the telecommunications industry.
Greg McCall, Chief Networks Officer at BT Group said: 'This trial with Nokia demonstrates the potential of RedCap technology in unlocking a new wave of innovation within the 5G services ecosystem. This is especially the case as we move towards the arrival of 5G SA, bringing with it enhanced reliability, responsiveness, security, and speed which - through 5G RedCap - promises to benefit a host of new IoT devices and use cases.'
Robert Moffat, Deputy Director Europe Mobile Business Development at MediaTek, said: 'Our collaboration with Nokia and BT Group for this trial of 5G RedCap technology aligns with MediaTek's commitment to driving innovation and expanding the potential of 5G SA to include a wider ecosystem of devices and use cases.'
Phil Siveter, CEO, UK and Ireland at Nokia, commented: 'The introduction of RedCap will unlock new 5G opportunities for many industries, with potentially billions of new devices connected with 5G. Our field tests with BT Group show that Nokia 5G Standalone networks are ready to support RedCap devices.'