GlobeNewswire | September 27, 2023
With the step-function increase in data collected and transmitted from cloud-connected edge nodes, Improved Inter Integrated Circuit® (I3C®) is rapidly becoming a more sustainable solution for interfacing sensors with a high data rate and will help expand capabilities in next-generation devices. Leading the way in I3C integration, Microchip Technology (Nasdaq: MCHP) has released its PIC18-Q20 family of microcontrollers (MCUs), the industry’s first low pin count MCUs with up to two I3C peripherals and Multi-Voltage I/O (MVIO). Available in 14- and 20- pin packages as small as 3 x 3 mm, the PIC18-Q20 MCUs are a compact solution for real-time control, touch sensing and connectivity applications. The MCUs offer configurable peripherals, advanced communication interfaces and easy connection across multiple voltage domains without external components.
With I3C functionality, flexible peripherals and the ability to operate on three independent voltage domains, PIC18-Q20 MCUs are well suited to be used in conjunction with a primary MCU in a larger overall system. This family of MCUs can perform tasks such as processing sensor data, handling low latency interrupts and system status reporting that the main MCU cannot perform as efficiently. While the Central Processing Unit (CPU) runs at a different voltage domain, the I3C peripheral operates from 1.0 to 3.6V. These low-power, small form factor MCUs can be used in a wide range of space-sensitive applications and markets including automotive, industrial control, computing, consumer, IoT and medical.
“One of the main barriers to large-scale IoT adoption is the cost of implementing an edge node. With the PIC18-Q20 family of MCUs, Microchip is helping to break down that barrier,” said Greg Robinson, corporate vice president of Microchip’s 8-bit MCU business unit. “By introducing the industry’s first low pin count MCU with I3C we are enabling flexible, cost-effective scaling of IoT applications and embracing the new standard communications interface.”
As the market shifts to demand higher performance solutions with lower power and smaller size, I3C helps designers and software developers address these potentially challenging requirements. Compared to I2C, I3C offers higher communication rates and lower power consumption, all while maintaining backward compatibility with legacy systems. The I3C and MVIO functionality, combined with Microchip’s configurable Core Independent Peripherals (CIPs), allow for lower system costs, reduced design complexity and a reduction in board space by replacing external level shifters with on-chip multiple voltage domains. To learn more about Microchip’s portfolio of PIC® MCUs, visit the website and keep up with the latest company news by following Microchip on LinkedIn, YouTube, Facebook and Instagram.
The PIC18-Q20 MCU family is supported by Microchip’s full development ecosystem of hardware and software tools, including its MPLAB® X and MPLAB Xpress Integrated Development Environments (IDEs) and MPLAB Code Configurator (MCC) Microchip’s development environment is straightforward and makes it easier to implement and generate code, allowing for a reduction in overall development time and reduced financial investment.
Developers can get a quick start in evaluating I3C and MVIO capabilities on the PIC18-Q20 using Microchip’s PIC18F16Q20 Curiosity Nano Evaluation Kit—a compact, cost-effective development board for rapid prototyping.
Microchip Technology Inc. | October 09, 2023
Microchip Technology introduced nine new FPGA and SoC solution stacks designed for vertical markets.
These solution stacks enable rapid deployment of intelligent edge solutions without requiring specialized expertise.
Customers have praised PolarFire FPGAs for their small footprint, energy efficiency, and high performance.
Microchip Technology has introduced nine new FPGA and SoC solution stacks, each tailored to meet specific requirements in vertical markets such as industrial edge, smart embedded vision, and edge communications.
Microchip aims to simplify the creation of industrial and communications designs by offering solution stacks that leverage the power efficiency, security, and reliability of PolarFire FPGAs. Companies like Xenics and KAYA Instruments have cited benefits such as small form factor, power efficiency, and energy efficiency in utilizing Microchip's FPGA solution stacks for their products.
In addition to the launch of its industrial edge stack and related tools earlier this year for Open Platform Communications/Unified Architecture (OPC/UA)-based IIoT applications, this increases the total number of PolarFire and SoC solution stacks to ten.
For Smart Embedded Vision:
CoaXpress among others
For Industrial Edge:
For Edge Communications:
Small Form-factor pluggable optical module
Software-defined radios and others
Customers mentioned several factors for choosing Microchip's FPGA solution stacks. Federic Aubrun, Chief Commercial Officer (CCO) of Xenics, a developer of infrared imaging sensors with products for short-, mid-, and long-wave IR imagers, cores, and cameras, emphasized the significance of size, weight, and power considerations in thermal imaging system design. He stated that Microchip's SmartFusion and PolarFire FPGAs offered the optimal combination of a compact form factor, power efficiency, and processing capabilities while operating within a highly efficient power budget in their current and future product lines.
These solution stacks provide detailed IP, reference designs, development kits, application notes, and demo guides, enabling the deployment of intelligent edge solutions. It stacks cater to the growing demand for quick deployment of intelligent edge solutions without the need for specialized technology knowledge. The solution stacks cover various areas, including H.264 compression, HDMI, serial digital interface, CoaXpress, motor control, OPC/UA, software-defined radios, USXGMII, SFP+ optical modules, and 5G ORAN, providing versatile options for different vertical markets.
Another company, KAYA Instruments, designs industrial-grade imaging equipment, such as small-form-factor, low-power cameras and frame grabbers that deliver high-quality video under ordinary to extreme ambient light conditions.
Michael Yampolsky, Founder and CEO at KAYA, stated,
We use PolarFire FPGAs due to their compact footprint and energy efficiency. Utilizing the most up-to-date CMOS sensor technology, they enable cameras to fit in tight spaces while maintaining high quality, low noise, exceptional dynamic range, and a large feature set. FPGAs on our platform enables us to rapidly bring the most advanced vision technology to market to meet the needs of our customers.
Intel | September 20, 2023
Intel is turning software into a new revenue-generating business division, based primarily on the AI obsession.
Intel is the first to bring a true AI accelerator to a PC with Meteor Lake.
Intel Xeon processors of the fifth generation will also debut on December 14.
Next year, the Sierra Forest E-core processor will be available with 288 cores.
Intel has revealed plans to launch an AI PC, set to be released on December 14, featuring Intel Core Ultra processors with a Neural Processing Unit (NPU). The new processors, codenamed Meteor Lake, will include Intel's NPU for AI acceleration and local inference on the PC, representing an inflection point in client processing. The move is part of Intel's effort to compete with Nvidia and expand its presence in the AI space across various compute needs.
CEO of Intel, Pat Gelsinger, noted ‘AI Everywhere' in a keynote address, surprising some who haven't been paying attention with a December 14 launch date for the AI PC running Intel Core Ultra processors with a comparatively new acronym, NPU, for Neural Processing Unit. In July, he first described the upcoming AI PC era.
The AI PC is expected to launch worldwide, with Acer already planning to unveil a laptop powered by the Core Ultra processor. Intel's AI PC represents a significant development, as it brings a true AI accelerator to a PC. This allows for generative AI tasks to be performed locally, faster, and with higher levels of privacy and security. The AI PC is expected to play a crucial role in supporting AI workloads on local devices, such as PCs, mobile devices, and edge devices.
Analyst at J. Gold Associates, Jack Gold, stated,
The significance of AI on a PC is not to be overlooked, this is a big deal. Intel is the first to bring a true AI accelerator to a PC with Meteor Lake. Microsoft is even adding capabilities in next-gen Windows to access the NPU.
[Source: Fierce Electronics]
Local processing power becomes crucial as AI workloads increasingly run on local devices. This shift reduces the need to transfer data to the cloud, improving efficiency and reducing latency. It aims to leverage AI to transform the PC experience, emphasizing the synergy between cloud and PC. This will allow for personal productivity and creativity enhancements. Intel's Core Ultra processors will include Fovoros packaging, combining the NPU, Intel 4 process technology, and graphics capabilities with Intel Arc graphics.