Telit | June 15, 2022
Telit, a global enabler of the Internet of Things (IoT), today announced a new global corporate headquarters in Southern California. Following the CEO's move to the U.S., the new headquarters is in the City of Irvine Orange County's technology hub and will support Telit's strategy to grow its connected devices and solutions business worldwide. The Irvine office will also serve key projects and customers in the region, widening its U.S. presence that currently includes offices in Illinois, Florida and North Carolina.
"These are exciting times for Telit, Choosing a global headquarters in California is a move consistent with the objective of strengthening our market position as a leading western player in the IoT connected devices and solutions arena. Particularly now with a 100% Western shareholder structure it's a move that poises Telit for major growth and expansion in 2022 and beyond."
Paolo Dal Pino, CEO, Telit
Today, Telit's headquarters, research and development centers, and sales and operations offices continue to expand globally, with 28 locations on six of the seven continents which include R&D centers in the U.S., Italy, Korea and India. As a driver enabling Industry 4.0. and digital transformation, Telit provides enterprises with best-in-class device management and connectivity solutions that are essential to technologies powering smart cities, transportation, manufacturing, automotive, retail, healthcare and beyond. Telit's IoT experts renowned for pioneering a successful end-to-end system approach ensure Telit modules, connectivity and platforms all work seamlessly together to scale IoT deployments today and in the future. In addition to implementing thousands of successful IoT solutions worldwide, Telit continues to invest in its technology roadmap to push the industry forward for years to come.
Telit simplifies onboarding of connected 'things' with a portfolio of enterprise-grade wireless communication and positioning modules; cellular MVNO connectivity plans and management services; edge and cloud software; and data orchestration, IoT and Industrial IoT platforms. With over two decades of pioneering IoT innovation experience, Telit delivers award-winning, secure, integrated IoT solutions for many of the world's largest enterprises, OEMs, system integrators and service providers, so they can connect and manage IoT at any scale.
MicroEJ | July 01, 2022
MicroEJ, leading provider of software containers for IoT and embedded devices, today announced the availability of Android Compatibility Kit, connecting global electronic things manufacturers to a fast-growing ecosystem of Android Studio and associated developers.
This new release consolidates MicroEJ’s positioning as the “tiny sibling of Android” for small and constrained smart devices. By enabling the same software to run on either MicroEJ or Android execution environment, manufacturers can easily switch from a powerful processor to a smaller one (from ex.: Arm Cortex-A to Arm Cortex-M) to dramatically reduce energy consumption.
MicroEJ Android Compatibility Kit brings many great benefits to smart devices manufacturers:
Android Compatibility and Android Studio Support
MICROEJ VEE share the same technology principles as Android. It now also supports the development of applications with Android Studio and integrates with the Gradle build system.
Accelerated Development using Virtual Devices
MicroEJ enables development on virtual devices to parallelize hardware and software development and speed up specification validation. Android Studio can launch MicroEJ Virtual Devices just as Android Virtual Devices.
Greater Energy Efficiency
MicroEJ Android Compatibility Kit enables two processors to coexist and distribute same tasks between a very powerful processor powered by Android and a low-power processor powered by MicroEJ to dramatically reduce energy consumption.
Leveraging Hardware Innovation by removing Software-Hardware Inter-lock
By using standard software containers, application code built with MicroEJ is portable on the best hardware, independently from RTOS/OS combinations. It accelerates hardware evaluations and fosters the development of derivative products thanks to software API reuse.
Large Developer Ecosystem
The large ecosystem of Java/Kotlin developers can now use popular tools such as IntelliJ IDEA, Android Studio and Gradle to build MicroEJ applications, leveraging low-power features embedded at the heart of MICROEJ VEE for highly optimized resources usage.
Leveraging Hardware IP’s for vector graphics
MICROEJ VEE eases the usage of Graphic Processing Units (GPU), enabling a similar look and feel as smartphone apps. MicroVG provides support for Android Vector Drawables and SVG formats for impeccable UI/UX on any type of screen and leverages any vector GPU when necessary.
The MicroEJ Android Compatibility Kit is especially valuable in battery-operated industries such as smartwatches and thermostats, allowing the development of cost-optimized and energy-efficient products. MicroEJ is a lightweight option that enables to expand product lines with the same user experience from low-end to premium devices.
“With this new offering from MicroEJ, developers can utilize processor capabilities while minimizing software development costs. This is of great value to our customers, particularly for those who build multiple product families using the breadth of our advanced portfolio of secure and energy efficient embedded processors from MCUs, to crossover i.MX RT and i.MX applications processors. For example, our recent collaboration with MicroEJ to enable the i.MX RT500 crossover MCU has been highly successful in simplifying access to its unique architecture of low-power and graphics. It’s a win-win for our customers.”
Said Joe Yu, Vice President and General Manager, IoT Edge Processing Line, NXP® Semiconductors.
“We are proud to release Android Compatibility Kit to enable the vast community of Android developers to design Android compatible applications for microcontrollers and small, low-power microprocessors. With this new release, MicroEJ is reinforcing its leading position on the smart things market for its global, easy-to-use and secure MICROEJ VEE application container, which provides a modern development process for any kind of software-enabled electronic project.”
Said Dr. Fred Rivard, MicroEJ’s CEO.
Android Compatibility Kit is currently successfully used with lead customers for the production of mass-market electronic products. Visit Android Compatibility Kit webpage to stay tuned.
MicroEJ is bringing container virtualization to IoT and embedded devices. We are focused on providing device manufacturers with secure application containers in markets where software applications require high performance, compact size, energy efficiency, and cost-effective development.
With over 100 million products sold, all the leading global manufacturers have chosen MicroEJ to design their electronic devices for a large variety of industries, including smart home, wearables, healthcare, industrial automation, retail, telecommunications, smart city, building automation, transportation, etc.
Renesas | June 27, 2022
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, is changing the way designers build sensor-connected IoT applications with a range of new solutions targeted at faster design cycles, improved accuracy, and reduced system cost.
In addition to the new HS4XXX family of relative humidity and temperature sensors, Renesas is introducing the ZSSC3281 sensor signal conditioning (SSC) IC for highly accurate amplification, digitization, and sensor-specific correction of sensor signals. These new products complement Renesas’ extensive MCU portfolio and embedded AI solutions.
The sensor design process is supported by Renesas’ unique system design platform that significantly eases the prototyping of IoT systems. The Renesas Quick-Connect IoT system consists of standardized boards and interfaces, enabling designers to quickly and easily connect a wide range of sensors to MCU/MPU development boards. The new system also delivers core software building blocks that are portable between boards, greatly reducing coding requirements. Now, instead of writing and testing hundreds of lines of driver code, designers only need to graphically select their sensor and write a few lines of code. All the integration and setup effort happen behind the scenes, reducing the time to a working solution.
Renesas also provides numerous Winning Combinations that combine sensors with multiple other ICs to offer customers an elevated design platform that mitigates the design risks and reduces development time.
According to a recent Zion Market Research study, the Global IoT sensors market is estimated to grow at a compound annual growth rate (CAGR) of approximately 27.9%, reaching an estimated $27.9 billion by the year 2028.
“Sensing solutions are a critical element in IoT systems, and present numerous design challenges during system integration that can slow development and impact overall system performance, The combination of our sensor technology, signal conditioning expertise, and system solution mindset enables us to deliver customers a design platform that is unmatched by any competitor.”
DK Singh, Senior Director of the Systems and Solutions Team at Renesas
With more than 20 years’ experience, Renesas has deep and broad expertise in the sensor market. Renesas’ portfolio includes sensor signal conditioners, biosensors, humidity and temperature sensors, light and proximity sensors, flow sensors, and position sensors.
HS4XXX Relative Humidity and Temperature Sensors
The new HS4XXX family of relative humidity and temperature sensors provides high accuracy, fast measurement response time, and ultra-low power consumption in a small package size, making them ideal for a wide number of applications ranging from portable devices to products designed for harsh environments. More information on the new family is available at renesas.com/humidity.
Key features of the HS4XXX Relative Humidity and Temperature Sensors
Very low current consumption: 0.3µA average for 8-bit resolution with a 3.3V supply
Ultra-low sleep current: 0.010 µA
Small 2.5 × 2.5 × 0.9 mm DFN-style 8-LGA package
Highly accurate relative humidity sensing of ± 1.5% RH
Temperature sensor accuracy of ±0.2°C typical
ZSSC3281 Sensor Signal Conditioning IC
The new ZSSC3281 SSC delivers highly accurate amplification, digitization, and sensor-specific correction of sensor signals. It includes a two-channel analog front end as well as an integrated ARM-based MCU with embedded mathematics for sensor signal processing. It targets high-end applications including industrial, medical and consumer sensing.
Key features of the ZSSC3281 Sensor Signal Conditioning IC
Highest performance with flexible analog front-end configurations
Dual-speed mode for highest accuracy combined with fastest update rate
2 ADC’s running in parallel with up to 24-bit resolution
Enables broad use for different sensor elements with multiple characteristics
Measurement scheduler for optimized performance
Advanced interrupt and diagnostic functions
Digital interfaces including I²C, SPI, and One Wire Interface (OWI)
4-20mA current loop output, OWI communication via current loop
About Renesas Electronics Corporation
Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
OriginGPS | June 21, 2022
OriginGPS, the global market leader in miniature GNSS modules and cellular IoT systems, is back presenting high-performance solutions suited for every type of device designed to monitor and track valuable assets, whether stationary, in motion or both. OriginGPS today offers a broad range of high-efficiency solutions; traditional miniature GNSS modules and cellular IoT systems and devices to dramatically shorten time to market.
Among products exhibited at the show are the 7x7mm ORG4572-MK05 GNSS module with a 10Hz update rate, the new gen dual frequency L1+L5 ORG4600 providing cm level accuracy with RTKLIB and NMEA with raw data in parallel, the world's lowest profile GPS antenna module - the ORG1511-MK05, and a new waterproof super-mini tracker measuring just 4.9x2.7x1.4cm and equipped with magnetic charging.
"When we realized that the component shortage was here to stay a while, we revisited our roadmap and added two GNSS modules - the ORG1510-MK05 and the ORG4572-MKO5. These new models, parallel in performance to two of our high runners, are based on available chipsets and boast a lead time of just 12 weeks, we also offer today a similar lead time for our dual frequency module,"
Amir Benyamini, VP Research and Development of OriginGPS
OriginGPS develops miniature GNSS and cellular IoT solutions. For over a decade, our experts have been developing ultra-sensitive, reliable, high-performance modules, systems and devices to help monitor and track everything valuable to you and your business. Reducing project costs and dramatically shortening time-to-market, our products are ideal for asset tracking, smart cities, fleet management, precision agriculture, law enforcement, and pet/people tracking apps.