INDUSTRIAL IOT

Qualcomm IoT Solutions Power Modern Smart Warehouse by Zyter for OneScreen

Zyter | October 26, 2021

today announced they are implementing  a state-of-the-art, next-generation smart warehouse for OneScreen located in San Diego which will be equipped with products from Qualcomm Technologies, Inc. The smart warehouse design for OneScreen plans to include an LTE-private network, implementation of a digital twin, robust warehouse management system, autonomous mobile robots (AMR), AR/VR technologies, IoT sensors and more. The modern smart warehouse will increase warehouse operational efficiencies, enable automated inventory control, enhance safety and security within the facility and save time and money for OneScreen employees and customers. This smart warehouse project exemplifies how Qualcomm Technologies and its IoT ecosystem are critical to enabling the global digital transformation of industries with a differentiated approach that leverages the growing number of smart devices that make up the connected intelligent edge.

Through the Qualcomm® IoT Services Suite and its ecosystem of 400+ Qualcomm® Smart Cities Accelerator program members, Qualcomm Technologies has acted as a catalyst in enabling the accessibility and ease of deployment for businesses and entities looking to adopt end-to-end smart solutions, fueling digital transformation and deployments of smart spaces. Implementing smart connected spaces frequently involves sourcing, developing and integrating multiple fragmented technologies. The unique IoTaaS model is designed to remove the need to invest in costly and fragmented efforts. Adopting IoTaaS enables streamlined, end-to-end solutions, taking the place of lengthy processes that previously took months or years and can shrink timelines to a matter of weeks. Ultimately this supports rollout with faster time to commercialization and provides increased accessibility to smart solutions and infrastructure for businesses and communities.  

For this project, Zyter will be responsible for implementing its Smart Warehouse module running on the Zyter SmartSpaces™ IoT platform.  As a key collaborator with Qualcomm Technologies for the Qualcomm Smart Cities Accelerator Program ecosystem, the SmartSpaces platform breaks down silos of information by integrating and consolidating data from IoT devices and applications in a seamless interface. In addition, the Smart Warehouse will contain the private LTE CBRS (Citizens Broadband Radio Service) network cell sites powered by Qualcomm® RAN Platforms for Small Cells, and CPEs featuring  Qualcomm® Fixed Wireless Access Platform, with an upgrade path to 5G in the future. Members of the Qualcomm Smart Cities Accelerator Program ecosystem are supplying trackers, cameras, and sensors needed for enabling the smart warehouse. Zyter will be implementing and deploying the LTE private network as well as managing and installing the integration of all hardware, sensors, and the warehouse management system (WMS).    

“We are pleased Zyter has chosen Qualcomm Technologies’ IoT products for another IoTaaS commercial deployment with the smart warehouse for OneScreen,” said Sanjeet Pandit, senior director and global head of smart cities, Qualcomm Technologies, Inc. “To directly address the fragmented nature of the IoT industry, our unique Qualcomm IoT Services Suite is helping to bridge the gap for IoT service providers and entities looking to efficiently and effectively deploy smart solutions and is revolutionizing the way businesses and entities modernize their practices.”

“I am pleased to work with Zyter and Qualcomm Technologies, utilizing the Qualcomm IoT Services Suite to enable a smart warehouse in San Diego.  Implementation of the digital twin, autonomous mobile robots (AMR), AR/VR use cases, and IoT sensors will make this a state-of-the-art operation,” said Sufian Munir, chief executive officer, OneScreen. “This next-generation smart warehouse will increase productivity, enable automated inventory control, safety and security within the facility and save time and money for employees and customers.”

“This smart warehouse project exemplifies how Qualcomm Technologies and its IoT ecosystem are essential to enabling the global digital transformation of many different industries. Bringing IoT, artificial intelligence and virtual reality technologies to warehouses takes operations to a level never seen before.”

Sanjay Govil, founder and chief executive officer, Zyter, Inc.

About Qualcomm
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.

About Zyter
Zyter delivers a wide range of Internet of Things (IoT) solutions spanning buildings, stadiums, campuses, and even cities. The Zyter SmartSpaces platform supports solutions for multiple markets including healthcare, education, logistics, retail, travel, and construction. By integrating and consolidating data from IoT devices and applications, organizations can gain new insights to improve efficiencies while providing end-users with an engaging digital experience. In 2021, Zyter won more than 37 global awards for its IoT products including Best Technology and Company Innovation of the Year. Founded in 2017, the privately-held company is based in Rockville, Md. 

Spotlight

The deeper meshing of virtual and physical machines offers the potential to truly transform the manufacturing value chain, from suppliers through customers, and at every touchpoint along the way. Connected devices made possible by the Internet of Things (IoT) are here to stay – and the trend will only grow. As such, IoT presents unprecedented opportunities across industry sectors and processes. Leaders are already investing in IoT solutions — and are reaping benefits. Consider the case of Lido Stone Works, which leveraged IoT to automate streamlined solutions, boosting revenues by 70% and increasing productivity by 30%.


Other News

Scope AR Unifies the Digital Thread with Industrial IoT Capability

Scope AR | June 03, 2022

Scope AR today announced the launch of WorkLink IoT, a platform service that enables real-time data connectivity within industrial environments for augmented reality experiences. The service enhances WorkLink, its end-to-end enterprise AR platform, with Internet of Things- (IoT-) enabled devices and real-time data fabrics. The launch marks the first-ever offering of IoT connected data in a no-code AR platform. WorkLink IoT will become a critical component of the AR-enabled digital thread for manufacturing and field service use cases. Now, real-time data from smart tools and a wide array of industrial edge devices can be aggregated into augmented reality work instructions. “Our customers are absolutely thrilled to integrate machine data into their AR work instructions. Imagine measuring the torque of each fastening operation as you build a product, with instant feedback provided to the technician in augmented reality. That data can also be sent to any manufacturing or service systems of record in real time, This completely changes the quality control and compliance landscape for our customers, offering unprecedented traceability, insights, and human error avoidance.” Scott Montgomerie, CEO and founder of Scope AR WorkLink IoT is the result of a pioneering collaboration between Scope AR and Litmus Automation, a flexible and scalable edge platform for Industrial IoT data connectivity. The collaboration also involved fastener expertise by Click Bond, smart tools by Atlas Copco for precision torque measurement capabilities, and advanced 3D AR wearable devices including the Microsoft Hololens 2. “We are pleased to partner with Scope AR to provide access to all industrial data at the edge from any type of machine or tool,” said John Younes, Co-founder and COO of Litmus. “Our technology allows WorkLink IoT to connect to any device in minutes, normalize the data for easy consumption, and integrate the data with the AR platform. Now customers can focus on getting value out of their data and the AR solution rather than spending time solving operational complexity since we’ve done that work.” Click Bond President and CEO Karl Hutter commented, “As a pioneer of advanced assembly solutions for aerospace, Click Bond recognizes the opportunity to unlock technicians’ talents using XR and IoT tools, expanding their capabilities and raising the value of their work. We are proud to partner with Scope AR in bringing this to reality!” “Previously, customers were forced to hard-code their own data pathways or manage disparate systems in order to enable smart factory data into augmented reality experiences,” said Montgomerie. “This has limited production use cases at scale. Instead, we partnered with Litmus and built a system to allow any available edge data feed to be accessed from within our code-free AR environment, removing any compatibility or development inhibitors to scale.” WorkLink IoT is another pillar of Scope AR’s digital thread offering, with the goal of providing real-time data to technicians and systems of record throughout the physical product lifecycle.

Read More

DEVICES

Telit Launches WE310G4 Dual-Band Wi-Fi Module with BLE 5.0

Telit | January 27, 2022

Telit, a global enabler of the Internet of Things (IoT), today announced the WE310G4 module, which enables device vendors to add dual-band Wi-Fi and Bluetooth Low Energy (BLE) 5.0 connectivity quickly and cost-effectively to their products. Based on Realtek Ameba system on chip (SoC), the WE310G4 is ideal for a wide variety of embedded devices, including smart lighting, home appliances, medical wearables, smart city sensors, aftermarket telematics and industrial robots. The Telit WE310G4 is ideal for vendors that have limited Wi-Fi or BLE expertise, as well as those with extensive RF experience that want to reduce time to market for new products. The module is IEEE 802.11 a/b/g/n and Bluetooth certified, and complies with all Wi-Fi Alliance and Bluetooth SIG-v5 requirements, eliminating the time and expense of testing and certification. The WE310G4 provides device vendors with a low-cost, high-speed serial-to-Wi-Fi/BLE connection to an embedded design built on an 8/16/32-bit microcontroller. Furthermore, the module can be implemented as a host-less solution offering up to 456 Kb of SRAM dedicated to customer application development. With marketing samples available in February 2022, the module includes a comprehensive package of features and capabilities: Integrated, dual-core SoC, a high-performance application processor (running on ARM Cortex-M33) and a low-power MCU (ARM Cortex-M23) for Wi-Fi and BLE. Support for a wide range of peripherals: SDIO, SPI, UART, ADC, PWM, GPIO, I2S, I2C and USB. Low power consumption to maximize battery life. Industrial grade temperature range (-40 °C to +85 °C). Self-contained with full Wi-Fi, BLE and TCP/ IP networking stacks. A complete suite of advanced security features including Secured Boot, TrustZone for Cortex-M, WPA3 personal and enterprise security modes, as well as upper-layer security protocols such as TLS-1.3/SSL and HTTPS. Serial-to-Wi-Fi hosted implementation. Telit IoT AppZone IDE for host-less application development. Pin-to-pin compatible with the Telit WE310F5 (single-band module), enabling rapid migration of existing hardware and software to the WE310G4. Available with (WE310G4-I) and without (WE310G4-P) antenna. "Ultra-low power consumption, small size, and high security are critical for modules integrating with the global IoT ecosystem. While the IoT market offers a wide range of small modules, none compares to Telit's WE310G4 when it comes to quickly and cost-effectively adding dual-band Wi-Fi and Bluetooth connectivity into their customer products. Combined with Realtek Ameba SoC, the WE310G4 is the perfect solution for home, medical, and industrial IoT applications." Yee-Wei Huang, Realtek's Vice President and Spokesman "The new Telit WE310G4 module gives vendors a fast, easy way to add Wi-Fi or BLE to their products — even if they have little or no in-house RF expertise," said Manish Watwani, Chief Marketing and Product Officer, Telit. "It's ideal for vendors that want to develop wearables, IoT sensors and other products with enterprise-grade security, long battery life and other market-differentiating features, and then have them in customers' hands before competitors do." About Telit Telit simplifies onboarding of connected 'things' with a portfolio of enterprise-grade wireless communication and positioning modules; cellular MVNO connectivity plans and management services; edge and cloud software; and data orchestration, IoT and Industrial IoT platforms. With over two decades of pioneering IoT innovation experience, Telit delivers award-winning, secure, integrated IoT solutions for many of the world's largest enterprises, OEMs, system integrators and service providers, so they can connect and manage IoT at any scale.

Read More

SOFTWARE AND TOOLS

Renesas Launches World’s Most Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas | June 22, 2022

Renesas Electronics Corporation announced the SmartBond™ DA1470x Family of Bluetooth® low energy (LE) solutions the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity. The DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU) and Bluetooth LE connectivity all into a single chip. This combined functionality provides smart IoT devices with the most advanced sensor and graphical capabilities and seamless, ultra-low-power, always-on audio processing. The new family is ideal for wearables like smartwatches and fitness trackers; glucose monitor readers and other consumer medical and healthcare devices; home appliances with displays; industrial automation and security systems; and Bluetooth consoles such as e-bikes and gaming equipment. “The DA1470x family expands on our successful strategy of integrating more functions, including greater processing power, expanded memory and improved power modules, along with VAD for always-on wake and command word detection, This feature-packed SoC product family enables developers to push the boundaries of connected consumer and industrial applications and future-proof their IoT products to fit the needs of multiple applications, while optimizing their bill of materials.” Sean McGrath, Vice President of the Connectivity and Audio Business Division in Renesas’ IoT, Industrial and Infrastructure Business Unit The high level of integration further results in significant cost savings on the Bill of Materials (BoM), enabling cost-effective system solutions. It also reduces component count on the PCB enabling smaller form factor designs and freeing up space for additional components or larger batteries. With less components on the PCB, the reliability of the system is also improved, delivering a further reduction in the total cost of goods sold (COGS) of the end product. The SmartBond DA1470x Family is already gaining acceptance in the market. For example, the DA14706 is at the heart of the newly launched Xiaomi Mi band 7 with an eye catching 1.62“, 192x490 AMOLED display, 120 sports modes and a 15-day battery life for typical use. Key Features of the DA1470x Wireless SoCs Multi core system – Arm® Cortex®-M33 processor as the main application core and Cortex -M0+ as the sensor node controller. Integrated 2D GPU & Display controller supporting DPI, JDI parallel, DBI and Single/Dual/Quad SPI interfaces. Configurable MAC supporting Bluetooth® LE 5.2 and proprietary 2.4 GHz protocols. Integrated 720mA JEITA-compliant USB charger supports rechargeable Li-ion/Li-Po batteries. Integrated low quiescent current SIMO DC/DC converter of the PMU efficiently supplies internal system and external components Ultra-low power hardware VAD enables seamless and always on audio processing Winning Combination Renesas has combined the new DA1470x with multiple components from its broad range of embedded processing, analog, power and connectivity portfolio to create two new Winning Combinations: a Wearable Activity Tracker and an Instrument Panel for Light EVs and eBikes. Renesas offers more than 300 Winning Combinations with compatible devices from the Renesas product portfolio to enable customers to speed up the design process and bring products to market more quickly. They can be found at renesas.com/win. Availability The DA1470x Family consists of four new devices, all of which are in mass production and widely available now. More information about all the new devices is available at renesas.com/DA1470x. About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.

Read More

INDUSTRIAL IOT

Renesas Launches Automotive Actuator and Sensor Control MCUs for Evolving Edge Applications in Next-Generation E/E Architecture

Renesas | December 18, 2021

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced two new microcontrollers (MCUs) designed for automotive actuator and sensor control applications supporting edge evolution in next-generation electronic and electrical (E/E) architecture. With the new RL78/F24 and RL78/F23, Renesas expands its RL78 Family of low-power 16-bit MCUs and strengthens its broader automotive portfolio, offering customers highly reliable, high-performance solutions for systems ranging from actuators to zone control. With E/E architecture extending to include zone and domain control applications, control mechanisms are evolving to accommodate body control for automotive systems such as lights, windows, and mirrors; motor control for engine pumps and fans; and multiple sensor control. Moving forward, high-speed and secure connectivity with zone and domain controllers will be mission critical for edge electronic control units (ECUs). Renesas’ next-generation RL78/F24 and RL78/F23 MCUs address changing technology demands for actuator and sensor control with enhanced security, rich connectivity, and functional safety capabilities. The new devices support the CAN FD high-speed communication protocol (RL78/F24) and EVITA-Light security and are optimized for systems targeting ASIL-B levels under the ISO 26262 functional safety standard. Advances in E/E architecture add stress to the already heavy development burden, and there is high demand among our customers to efficiently develop actuators.Our new actuator and sensor control MCUs build on our highly popular RL78/F14 and RL78/F13 devices and enable developers to reuse most of their existing software assets, reducing costs while continuing to accelerate the advancement of E/E architecture.” Naoki Yoshida, Vice President, Automotive Digital Products Marketing Division at Renesas The future of automotive systems design lies in a vehicle-centralized, zone-oriented E/E architecture, and that shift is sparking higher demand for more advanced functionality and better performance in actuator controller applications. The new RL78/F24 and RL78/F23 MCUs deliver up to approximately 70 percent faster operating frequencies than the previous generation, which can more than double the performance in brushless motor control (BLDC) applications. Renesas also enhanced the hardware accelerator and timer functions for motor control and added a 12-bit A/D converter, offering customers the enhanced functionality and performance levels they demand. Key Features of RL78/F24 and RL78/F23 MCUs 40 MHz operating frequency Supports several connectivity interfaces, including CAN FD (RL78/F24), LIN, SPI, and I2C EVITA-Light support security functionality (support for AES-128/192/256 encryption algorithms) Pin compatible with the RL78/F14 and RL78/F13 MCUs with the same power efficiency On-chip flash memory capacity of 128 KB or 256 KB Package lineup ranging from compact 5 × 5 mm 32-pin QFN to 100-pin QFP Support for high temperatures up to 150°C RL78/F24 Target Board and RL78/F24 12V Motor Control Evaluation System Starter Kit soon to be released for RL78/F24 (under development) Availability Samples of the RL78/F24 and RL78/F23 MCUs will be available starting April 2022, and are scheduled to enter mass production in the second half of 2023. About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live. A global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of automotive, industrial, Infrastructure, and IoT applications that help shape a limitless future.

Read More

Spotlight

The deeper meshing of virtual and physical machines offers the potential to truly transform the manufacturing value chain, from suppliers through customers, and at every touchpoint along the way. Connected devices made possible by the Internet of Things (IoT) are here to stay – and the trend will only grow. As such, IoT presents unprecedented opportunities across industry sectors and processes. Leaders are already investing in IoT solutions — and are reaping benefits. Consider the case of Lido Stone Works, which leveraged IoT to automate streamlined solutions, boosting revenues by 70% and increasing productivity by 30%.

Resources