The new BG773A-GL ultra-compact LTE Cat M1, NB1 and NB2 module from Quectel Wireless Solutions support integrated SIM (iSIM) technology. For integrators and IoT service providers, the iSIM functionality of this new module offers enormous flexibility and simplicity since, in effect, it makes it possible for a device with a single stock-keeping unit (SKU) number to have the proper connection to serve its demands internationally. Finally, this eliminates the requirement for country-specific SIM cards and streamlines the logistics of conventional, plastic SIM deployments by doing away with the need for on-site or in-country modifications, providing an easier approach for integrators to implement cellular connection.
To closely correlate module performance with the new generation of embedded and integrated SIM features that are changing what is possible in IoT connection, Quectel has been at the forefront of making the promise of iSIM a reality.
The MIPS 5150 CPU, integrated RAM, and flash, as well as the BG773A-GL module's ultra-low power consumption, all work together to lower current consumption to low levels in a variety of modes, including as power-saving mode (PSM) and extended discontinuous reception (eDRX). Importantly, the BG773A-GL has Integrated Security Elements, a robust hardware-based security feature (ISE). Because iSIM depends on a strong, secure element to connect to the best connection at the moment of deployment, this is crucial. Beginning in mid-July 2022, the module will be sold commercially.
"We're delighted to have launched the Quectel BG773A-GL module which brings iSIM-enabled connectivity to the global marketplace. By enabling integrators to create a single global product with one SKU, logistics and supply chain issues are eliminated and IoT organizations can simply deploy their products anywhere safe in the knowledge that they will be able to access secure, high-quality connectivity with no need for localization and different variants to be manufactured for different markets. This is a giant leap forward for simplifying IoT and one of the key steps needed to build a smarter world," says Richard Hart, Director of Global Connectivity, Quectel Connectivity Solutions.
The module's 14.9 mm 12.9 mm 1.9 mm ultra-compact SMT form factor makes it simple for integrators and developers to create applications that take advantage of its low power consumption and small size. The BG773A-industry-standard GL's interfaces and a plethora of features increase the module's appropriateness for use in several IoT applications, including wearable technology, smart meters, wireless point-of-sale, and tracking.
"Quectel's adoption of Kigen iSIM as a pre-packaged solution in the BG773A-GL is a testimony to the maturity of iSIM technology and our ecosystem. Quectel is a market leader in high-volume manufacturing, and this collaboration will enable OEMs who want to move quickly from pure embedded play to offering full IoT solutions for global markets,"
Vincent Korstanje, CEO of Kigen