Ventev | August 10, 2022
Ventev, a division of TESSCO Technologies, Inc. a leading value-added distributor and solutions provider for the wireless industry, announced the launch of its new Universal Broadband Enclosure. This compact, modular, and lightweight solution powers, protects, and enables reliable backup for radio and networking equipment in harsh environments.
The Universal Broadband Enclosure is the latest addition to Ventev’s Power Systems product line. Its compact design offers an ideal fit for locations where aesthetics and footprint are important. This NEMA 3R rated enclosure is designed to power and protect in harsh conditions, including outside plant environments.
The Universal Broadband Enclosure is engineered for industrial networking switches and routers, edge computer devices low-to medium-power, remote radio heads, and other wireless system elements. It comes standard with a pre-installed, hot swap 48VDC rectifier that is expandable up to 1400W with the option of adding battery strings to an isolated battery box. The lightweight powder-coated aluminum construction also offers superior corrosion-resistant properties.
“Ventev’s Universal Broadband Enclosure features a factory pre-wired and integrated system designed to cut down on installation time and deployment costs, as well as reduces the risk of field wiring errors, The various mounting options make this highly versatile solution ideal for critical broadband, Industrial IoT (IIoT), and edge mobile data applications.”
Thad Lowe, General Manager of Ventev
Ventev, a division of TESSCO Technologies Inc., designs and manufactures industry-leading Wi-Fi and wireless infrastructure products, to ensure reliable network performance and simplify the installation of Wi-Fi, IoT, LTE, DAS, and two-way networks. After you choose the radio, choose Ventev to connect, protect, and enable your wireless radio network.
About TESSCO Technologies Incorporated
TESSCO Technologies, Inc. (NASDAQ: TESS) is a value-added technology distributor, manufacturer, and solutions provider serving commercial customers in the wireless infrastructure ecosystem. The Company was founded more than 30 years ago with a commitment to deliver industry-leading products, knowledge, solutions, and customer service. Tessco supplies more than 65,000 products from 250 of the industry’s top manufacturers in mobile communications, Wi-Fi, Internet of Things (“IoT”), wireless backhaul, and more. Tessco is a single source for outstanding customer experience, expert knowledge, and complete end-to-end solutions for the wireless industry.
Scope AR | June 03, 2022
Scope AR today announced the launch of WorkLink IoT, a platform service that enables real-time data connectivity within industrial environments for augmented reality experiences. The service enhances WorkLink, its end-to-end enterprise AR platform, with Internet of Things- (IoT-) enabled devices and real-time data fabrics. The launch marks the first-ever offering of IoT connected data in a no-code AR platform.
WorkLink IoT will become a critical component of the AR-enabled digital thread for manufacturing and field service use cases. Now, real-time data from smart tools and a wide array of industrial edge devices can be aggregated into augmented reality work instructions.
“Our customers are absolutely thrilled to integrate machine data into their AR work instructions. Imagine measuring the torque of each fastening operation as you build a product, with instant feedback provided to the technician in augmented reality. That data can also be sent to any manufacturing or service systems of record in real time, This completely changes the quality control and compliance landscape for our customers, offering unprecedented traceability, insights, and human error avoidance.”
Scott Montgomerie, CEO and founder of Scope AR
WorkLink IoT is the result of a pioneering collaboration between Scope AR and Litmus Automation, a flexible and scalable edge platform for Industrial IoT data connectivity. The collaboration also involved fastener expertise by Click Bond, smart tools by Atlas Copco for precision torque measurement capabilities, and advanced 3D AR wearable devices including the Microsoft Hololens 2.
“We are pleased to partner with Scope AR to provide access to all industrial data at the edge from any type of machine or tool,” said John Younes, Co-founder and COO of Litmus. “Our technology allows WorkLink IoT to connect to any device in minutes, normalize the data for easy consumption, and integrate the data with the AR platform. Now customers can focus on getting value out of their data and the AR solution rather than spending time solving operational complexity since we’ve done that work.”
Click Bond President and CEO Karl Hutter commented, “As a pioneer of advanced assembly solutions for aerospace, Click Bond recognizes the opportunity to unlock technicians’ talents using XR and IoT tools, expanding their capabilities and raising the value of their work. We are proud to partner with Scope AR in bringing this to reality!”
“Previously, customers were forced to hard-code their own data pathways or manage disparate systems in order to enable smart factory data into augmented reality experiences,” said Montgomerie. “This has limited production use cases at scale. Instead, we partnered with Litmus and built a system to allow any available edge data feed to be accessed from within our code-free AR environment, removing any compatibility or development inhibitors to scale.”
WorkLink IoT is another pillar of Scope AR’s digital thread offering, with the goal of providing real-time data to technicians and systems of record throughout the physical product lifecycle.
Digi | June 23, 2022
Digi International, a leading global provider of Internet of Things (IoT) solutions, connectivity products and services, today extended its IoT solution portfolio with the unveiling of its new Digi ConnectCore® MP1 family of system-on-modules (SOMs). The MP1 is the industry’s smallest STM32MP1 SOM that integrates Wi-Fi, Bluetooth and wired connectivity without comprising design flexibility.
This solution is made complete with its Connected Device platform as well as its well-tested development tools and design support. This makes Digi ConnectCore MP1 SOMs a cost-effective wireless solution for original equipment manufacturers (OEMs) seeking to reduce risk and effort in their product development. Ideal Digi ConnectCore MP1 applications include handheld products with cameras and/or displays such as medical devices, environmental test equipment, industrial human machine interfaces, or headless devices such as EV charging stations, renewable-energy controllers and others.
Leveraging both new and market-proven STM32MP1 micro processing units (MPUs) from STMicroelectronics (STM), Digi ConnectCore MP1 SOMs offer more features with a lower total cost of ownership. The form factor is smaller than a postage stamp (29x29 mm), which is ideal for form-factor-challenged applications with low-profile requirements. These off-the-shelf family of Digi ConnectCore MP1 SOMs bring scalability, compatibility and pre-certified wireless connectivity in a solution suitable for a broad range of applications in the healthcare, transportation and industrial sectors.
The unique Digi SMTplus™ surface-mount form factor provides design flexibility by enabling more complex applications through land grid array (LGA) pads and less complex applications using edge-castellated pads. By eliminating the need for connectors, ConnectCore SOMs shrink the bill of materials and offer greater suitability for high-vibration and harsh environment applications where connectors are prohibitive.
Small Form Factor Packed with High-Performance Features
STM32MP15x, single/dual Cortex-A7 @ 650 MHz
Cortex-M4 companion processing core for real-time tasks (STM32MP15x only)
Pre-certified Wi-Fi 5 802.11a/b/g/n/ac + Bluetooth 5.0 (including DLE) option
Up to 1 GB SLC NAND flash, up to 1 GB DDR3
Unique ultra-low power and wake-up state management
Dual 10/100/1000 Ethernet connectivity (single 10/100/1000 Eth for STM32MP15x)
Fully validated embedded Linux software platform (Digi Embedded Yocto)
Digi TrustFence® embedded security framework – ready-to-use security features
Off-the-shelf development board and low-cost gateway reference design
Industrial reliability and operating temperature with leading hardware warranty
“Digi ConnectCore MP1 SOMs respond to the challenge of building intelligent, connected and secure wireless products in strongly regulated markets such as the healthcare, transportation, and industrial sectors, Unlike other SOMs, Digi ConnectCore MP1 provides a scalable, highly integrated solution that encompasses a complete set of development tools, design support, software, and security building blocks to accelerate time to market. Digi also provides remote management and security services to simplify deployment and ongoing maintenance throughout the entire product lifecycle.”
Andreas Burghart, Senior Product Manager with Digi
About Digi International
Digi International is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting.
SOFTWARE AND TOOLS
Goodix | May 19, 2022
Today, Goodix Technology showcased its expanded product portfolio with major breakthroughs in sensing and connectivity solutions at the 2022 Goodix Tech Seminar in Shenzhen, China. Based on the company's strategic layout, Goodix continues to invest heavily in core technologies that drive innovation in IoT applications for a new era of smart connectivity. Two highlights of the seminar were the introduction of the new Bluetooth LE SoC and Time of Flight (ToF) solutions.
Featured Innovation Accelerates the Connection of Everything
In recent years, the major theme of new technological developments features heavily within the Internet of Things (IoT) field, which has caused widespread transformation within a wide array of industries. Recent data from IoT Analytics expected that the global number of connected IoT devices are to grow at a CAGR of 22% to 27 billion active endpoints by 2025, bringing huge market opportunities for smart wearables, smart home, and smart city connectivity applications.
Leveraging years of innovation in low-power wireless technology, Goodix debuts its new-generation Bluetooth LE SoC GR5526 series featuring stronger display driving capability, lower power consumption and faster connection. The solution integrates a dedicated 2.5D GPU to improve graphics rendering efficiency, and supports over 30 FPS on a 454*454 resolution display screen, enabling a superior visual experience for wearable device users. An ultra-low power system architecture is adopted to reduce the power consumption during Bluetooth transmission by 30% compared with previous generation products. Compatible with the latest Bluetooth 5.3, the solution delivers excellent RF performance for a more stable and rapid connection. Goodix is dedicated to innovating Bluetooth LE technology with a new GR533x series targeted at the smart home, smart tag markets to be released soon.
Additionally, Goodix's NB-IoT SoC solution that integrates an OpenCPU application system has been successfully applied to smart water meters in a joint cooperation with renowned industrial partners. Its innovative dual AP/CP core architecture not only improves the system stability and connection reliability, but also ensures ultra-low power consumption that can support the long battery-life of smart meters. Featuring high integration, ease of use, and competitive BoM cost, this solution will further extend Goodix's footprint in the broader IoT market.
Aiming to build an open IoT ecosystem, Goodix will continue to work with industry partners, and support mainstream integrated development environment (IDE) with rich peripheral resources to help customers accelerate the time-to-market of different wireless applications.
Creating a Smart Life with Diversified Sensing Applications
With strong expertise in acoustics, optics, and electronic sensing technology, Goodix stands at the forefront of the advancing sophistication of IoT applications.
During the seminar, Goodix demonstrated its Time of Flight (ToF) 3D sensing solution which integrates a ToF image sensor and a laser driver to enable high-precision depth measurement for various applications such as smartphones and robots. Utilizing a self-developed sparse to dense algorithm, the solution offers a 5-meter with error<1% high-precision ranging performance with low power consumption, facilitating smartphones to create a more accurate photo bokeh effect and a faster focusing capability at night. It also supports the functions of simultaneous localization and mapping (SLAM) and obstacle avoidance for intelligent navigation of sweeping robots with its combination solution of line-pattern and flood-pattern.
The ToF sensor features several patented technologies to help smart devices achieve better ambient light suppression, anti-interference, and high dynamic range (HDR). Together with an extensive set of hardware and software, reference designs, algorithms, and SDKs, Goodix can deliver turn-key solutions to enable the wider applications of ToF technology such as drone aircraft obstacle avoidance and height measurement, as well as facial recognition, and automobile safety.
In response to the strong growth of the wearable markets, Goodix has launched a rich solution portfolio of health sensors and VersaSensor (multi-functional interactive sensors) for smartwatches, bands, headphones, and VR/AR devices, and won large-scale commercial adoption by well-known global brands. As a step further, Goodix introduces its fingertip oximeter total solution that deploys the medical grade algorithms. Cooperating with related applications, it can provide effective health instructions and disease diagnosis & alerts for users at home.
We have always emphasized the principle of growing together with customers. We have an unwavering focus on our core technologies of sensing, processing, connectivity, and security. And in these fields, we will continue to create powerful collaborations with industrial leaders and ecosystem partners. Our aim is to expand commercial implementations of these innovative technologies and to bring a more intelligent, and connected life for consumers around the world."
Sandy Hu, President of Goodix.