Business Wire | September 29, 2023
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard. The Integrity 3D-IC Platform is fully compliant with the 3Dblox 2.0 standard language extensions, and the flows have been optimized for all of TSMC’s latest 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS®) and System-on-Integrated-Chips (TSMC-SoIC®) technologies. Through this latest collaboration between Cadence and TSMC, customers creating AI, mobile, 5G, hyperscale computing and IoT 3D-IC designs can model system prototypes to accelerate design turnaround time.
Prototyping requires two different types of feasibility-checking methods across the various 3DFabric technologies—coarse-grained feasibility for thermal and EM-IR analysis, and fine-grained feasibility for die-to-die connections. Coarse-grained feasibility is enabled through a system-level tool integration with the Integrity 3D-IC Platform, featuring Voltus™ IC Power Integrity Solution and Celsius™ Thermal Solver, providing seamless prototyping for all TSMC’s latest 3DFabric configurations. Fine-grained feasibility is enabled through a silicon routing solution as well as joint collaboration on the development of a next-generation auto-router for 3DFabric technologies, which includes performance-boosting prototyping capabilities that support TSMC’s InFO and CoWoS offerings, enabled through the Integrity 3D-IC platform.
The Integrity 3D-IC platform is certified for use with TSMC’s 3DFabric and the 3Dblox 2.0 specification. The platform combines system planning, implementation and system-level analysis in a single platform, and due to the shared infrastructure between Cadence 3D design and system analysis tools, customers can perform feasibility-checking much more efficiently. In addition, Cadence Allegro® X packaging solutions have been enhanced with advanced InFO-specific design rule checking (DRC).
The flows supporting the 3Dblox 2.0 standard provide chiplet mirroring, which lets engineers reuse chiplet module data, improving productivity and performance. In addition, the flows provide inter-chiplet DRC through the Cadence Pegasus™ Verification System, which helps designers create an inter-chiplet CAD layer for DRC automatically.
With multiple packaging options available for implementation of multi-die designs, early prototyping and feasibility studies are becoming increasingly important, said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. Through our continued collaboration with Cadence and with the addition of the latest prototyping features that support the 3Dblox 2.0 standard, we’re enabling customers to leverage our comprehensive 3DFabric technologies and the Cadence flows to significantly improve 3D-IC design productivity and time to market.
“The Cadence Integrity 3D-IC Platform is the unified solution that provides an efficient way for customers to leverage the new 3Dblox 2.0 prototyping capabilities to create leading-edge 3D-IC designs using TSMC’s 3DFabric technologies,” said Dr. Chin-Chi Teng, senior vice president and general manager in the Digital & Signoff Group at Cadence. “By working closely with TSMC, customers adopting our new flows for use with 3Dblox 2.0 standard can accelerate the pace of innovation with next-generation multi-chiplet designs.”
The Cadence Integrity 3D-IC Platform includes Allegro X packaging technologies and is part of the company’s broader 3D-IC offering. The offering aligns with the Cadence Intelligent System Design™ strategy, enabling customers to achieve system-in-package (SiP) design excellence. For more information on the Integrity 3D-IC platform, please visit www.cadence.com/go/integrity3dblox2.
EchoStar Corporation | September 22, 2023
EchoStar Mobile Limited, a subsidiary of EchoStar Corporation, has partnered with The Things Industries to offer hybrid satellite and LoRa Internet of Things solutions for businesses in Europe. This collaboration integrates EchoStar's satellite IoT capabilities into The Things Stack, a cloud-based LoRaWAN network server, enabling IoT devices to have seamless, real-time, two-way communication over satellite or terrestrial networks through a single, dual-transport, generic node.
The collaboration will benefit businesses and organizations across Europe by extending the reach and reliability of their IoT devices, particularly in challenging and remote areas. EchoStar Mobile's LoRa-enabled IoT network, launched last year, provides bi-directional, real-time LoRa connectivity across Europe. Integration with The Things Stack Cloud elevates this offering to a global scale, offering multi-country service continuity for sectors such as utilities, logistics, transportation and agritech.
The partnership allows for plug-and-play integration of satellite and terrestrial transports into the same node or module for IoT applications, offering cost-effective and reliable IoT deployments with continuous coverage, even in remote locations. It breaks the limitations of terrestrial infrastructure by introducing satellite connectivity to The Things Stack LoRaWAN Network Server and its Generic Node Concept Edition. It offers businesses the flexibility to expand their IoT deployments to areas previously considered inaccessible.
The partnership will be showcased at The Things Conference, a premier LoRaWAN event, where attendees will witness the capabilities of hybrid satellite-terrestrial IoT connectivity along with The Things Industries' Generic Node Concept Edition.
EchoStar Corporation is a global leader in satellite communication solutions, serving consumer, enterprise, operator, and government needs worldwide under its Hughes, HughesNet, and EchoStar brands. Operating in Europe as EchoStar Mobile Limited and in Australia as EchoStar Global Australia, the company provides a comprehensive suite of services. EchoStar Satellite Services L.L.C. owns and operates a fleet of 10 satellites, offering vital communication infrastructure to media, enterprise, and government clients. Hughes Network Systems, LLC leads the global satellite broadband market with HughesNet, catering to diverse budgets. EchoStar fosters innovation and seeks passionate individuals dedicated to shaping the future of communications.
PR Newswire | September 29, 2023
Telit Cinterion, a global enabler of the intelligent edge, today announced an enhanced secure-by-design products and services offering that builds on Thales' legacy of secure solutions for critical industry. Following the acquisition of Cinterion Internet of Things (IoT) assets from Thales at the end of 2022, this partnership is the next logical step in Telit Cinterion's strategic growth and evolution.
Prior to the Cinterion portfolio acquisition, both Thales and Telit Cinterion (formerly Telit) were actively implementing their respective security strategies. After the acquisition, the Thales and Telit Cinterion product management and product security teams spent time aligning those strategies and the corresponding execution plans, regarding:
Research and design policies
Product and services roadmap
The outcome of the analysis and effort is the adoption or continuation of a revised set of processes and policies within Telit Cinterion that builds on both companies' shared commitment to security.
"In an interconnected world powered by the Internet of Things, the need for cybersecurity is paramount. The increasing number of IoT devices has created a vast digital landscape, ripe for innovation but also vulnerable to malicious intentions," said Philippe Vallée, EVP Digital Identity and Security at Thales. "We are totally allied with Telit Cinterion in putting our best collective efforts and expertise into securing data, privacy, and critical infrastructures within the IoT ecosystem. This is essential to ensuring that innovation and security coexist for a safer digital future."
At a time when cyber security in the Internet of Things is finally taking center stage with governments and regulators, we are elated to join forces with Thales, our partner and shareholder, to provide the world's most secure IoT modules, connectivity plans and platforms, said Paolo Dal Pino, CEO at Telit Cinterion. For decades the security of IoT has largely gone unchecked and unregulated and that has been a contributor to the protracted adoption of the technology. We are happy to bring that to an end now.
The Telit Cinterion product portfolio blueprint combines the best aspects of existing product lines and roadmap items. The blueprint also serves as a reference for new platforms and products to integrate best practices and important security features and functions. For more information on IoT security, visit https://www.telit.com/iot-security.
About Telit Cinterion
Telit Cinterion is a global enabler of the intelligent edge providing complete solutions that reduce time to market and costs, delivering custom designed, ready for market connected devices in addition to maintaining the industry's broadest portfolio of enterprise-grade wireless communication and positioning modules, cellular MVNO connectivity plans and management services, edge-cloud software and data orchestration, and IoT and Industrial IoT platforms. As the largest western provider pioneering IoT innovation, Telit Cinterion delivers award-winning and highly secure IoT solutions, modules and services for the industry's top brands.