Enterprise Iot

BMW Partners AWS and Qualcomm to Drive Innovation in New-Gen Autos

bmw-partners-aws-and-qualcomm
  • BMW partners with AWS and Qualcomm to foster driving experiences
  • Snapdragon Ride to be used to integrate AI-augmented video function
  • The collaboration leverages AWS’s cloud-based compute and storage along with IoT sensing tools, generative AI and machine learning

 BMW has joined Amazon Web Services for a cloud partnership to propel IoT and AI capabilities into upcoming vehicle models set for a 2025 launch, augmented onboard ASAS software and sensors for driver warnings. Concurrently, BMW collaborated with Qualcomm Technologies to develop automated driving systems built on Qualcomm's Snapdragon Ride computer vision platform.

BMW's collaboration with AWS and Qualcomm aims to streamline production and enhance vehicle functions. BMW stated that centralized cloud computing enables scalability to handle increasing data volumes generated by advanced automated functions like adaptive cruise control and automated lane changing.  BMW's partnership with AWS and Qualcomm is geared towards optimizing production processes and elevating the capabilities of their vehicles.

According to BMW, the utilization of centralized cloud computing allows for greater scalability, effectively managing the surging volumes of data generated by sophisticated automated features such as adaptive cruise control and automated lane changing. This enhances the efficiency of manufacturing operations and empowers vehicles to deliver more robust and responsive automated driving experiences. The integration of cloud computing addresses the challenges posed by increasing data demands, laying the foundation for future innovations in connected and autonomous vehicles.

This collaboration leverages an existing ‘cloud data hub’ on AWS infrastructure, tapping into cloud-based computing, IoT sensing, storage, and AI tools, which include generative AI and machine learning. BMW reported that these technologies will enhance BMW's Neue Klasse line, enabling lifecycle management of the new driver assistance (ADAS) platform, automated braking, and steering functions. These Neue Klasse vehicles from 2025 will allow BMW engineers to respond swiftly to customer demands and introduce new features to enhance the automated driving experience. The Snapdragon Ride platform will integrate 360-degree AI-augmented video functionality for automated driving features.

Nicolai Martin, Senior Vice President for driving experience at BMW, mentioned,

In the next decade, consumer habits and expectations will drive more changes in the automotive industry than we’ve seen over the past 30 years.

[Source: RCRWirelessNews]

BMW's new driving platform will serve as a reference architecture for future BMW models, enabling the processing, cataloging, and storage of vast amounts of real-time driving data in AWS's Amazon S3 cloud storage engines. This data will support engineering teams in developing and training models using AWS's machine learning service, ‘SageMaker.’

General Manager of automotive and manufacturing, Wendy Bauer at AWS, stated,

Automated driving is about more than just convenience; it’s also aimed at providing driver assistance technology that helps prevent injuries and saves lives.

[Source: RCRWirelessNews]

Wendy Bauer explained that implementing these systems on the BMW Group's international scale required an approach that could process and analyze vast amounts of data, as well as learn and innovate, so automakers could develop safer and more reliable automated ADAS systems.

As the automotive industry undergoes a transformation towards a novel software-defined vehicle architecture that emphasizes high performance, energy efficiency, and scalability, Nakul Duggal, Senior Vice President for automotive and cloud computing at Qualcomm, said that its ongoing collaboration with BMW is dedicated to the development of advanced AI-driven driver assistance technologies, focusing on safety and security on a larger scale. He added that this partnership between AWS and BMW combines cutting-edge technology from their respective industries, aiming to provide a contemporary cloud-native software development ecosystem.

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Ceva Extends its Connect IP Portfolio with Wi-Fi 7 Platform for High-End Consumer and Industrial IoT

Ceva, Inc. | January 05, 2024

Ceva, Inc. (NASDAQ: Ceva), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, today announced the general release of its next generation RivieraWaves Wi-Fi 7 IP platform, further expanding its widely-licensed portfolio of connectivity IP, targeting high-end consumer and industrial applications including gateways, TVs, set-top-boxes, streaming media devices, AR/VR headsets, personal computing and smartphones. The RivieraWaves Wi-Fi 7 IP leverages all the latest advanced features of the IEEE 802.11be standard to deliver a premium high performance, cost- and power-optimized Wi-Fi solution for integration into the next wave of Wi-Fi Access Point (AP) and Station (STA) products. According to global technology intelligence firm ABI Research, annual Wi-Fi enabled chipset shipments will exceed 5.1 billion by 2028, with more than 1.7 billion of these chipsets supporting the Wi-Fi 7 standard. As Wi-Fi enabled device shipments continue to grow, increasing numbers of semiconductor companies and OEMs are choosing to integrate Wi-Fi connectivity into their chip designs, and need access to high quality Wi-Fi IP to reduce the development costs and risks. Spanning Wi-Fi 4/5/6 over the past decade, Ceva has already established a considerable leadership position in Wi-Fi IP licensing, with more than 40 licensees for its RivieraWaves Wi-Fi 6 IP family, serving a wide range of end markets and applications, from end points to access points, across the IoT sphere. Expanding on this leadership position, Ceva's RivieraWaves Wi-Fi 7 IP provides a unique, comprehensive 802.11be MAC and PHY solution for integration into the next generation of Wi-Fi SoC products. Andrew Zignani, Senior Research Director, ABI Research, commented: "Ceva's wireless connectivity IPs play an integral role in the proliferation of connectivity standards in the broad IoT markets, as is evident from their customer's success in shipping more than 1 billion connectivity chips annually. With the introduction of their RivieraWaves Wi-Fi 7 IP platforms, semiconductor companies and OEMs have a trusted partner to develop differentiated, high-performance Wi-Fi 7 chipsets for their connectivity roadmaps, with lower risk and a lower cost of ownership." Tal Shalev, Vice President and General Manager of the Wireless IoT BU at Ceva, stated: "The relentless expansion of Wi-Fi usage has pushed the Wi-Fi 7 standard to offer enhanced data throughput, improved latency and support more spectrum in the face of mounting network congestion. Achieving this requires highly complex, cutting-edge functionalities like 4K QAM modulation, Multi Link Operation and Multi Resource Unit to optimize link efficiency across the available bands. Our RivieraWaves Wi-Fi 7 IP platform incorporates all the features of this latest-generation, wireless standard, dramatically simplifying development and time-to-market for companies looking to add Wi-Fi 7 connectivity to their products." Wi-Fi 7's 4K QAM modulation scheme is a substantial increase on the previous 1K QAM of Wi-Fi 6, while Multi Link Operation (MLO) introduces dynamic channel aggregation, seamlessly combining heterogenous channels from the same or different bands to navigate interference and boost throughput. Similarly, Multi Resource Units (MRU) enables the creation of larger channel bandwidths by intelligently stitching together punctured or disjointed Resource Units within the same band. The outcome is not only a remarkable up to 5 times increase in raw speeds but also significantly reduced latency, thanks to diminished contentions and retries. About Ceva, Inc. At Ceva, we are passionate about bringing new levels of innovation to the smart edge. Our wireless communications, sensing and Edge AI technologies are at the heart of some of today's most advanced smart edge products. From Bluetooth connectivity, Wi-Fi, UWB and 5G platform IP for ubiquitous, robust communications, to scalable Edge AI NPU IPs, sensor fusion processors and embedded application software that make devices smarter, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple – to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. 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Morse Micro | January 09, 2024

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Industrial IoT

Casa Systems Unveils New AurusXT 5G Industrial IoT Router Series Featuring the World’s First Dynamic Slicing Support

Casa Systems | January 10, 2024

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