Enterprise Iot, Devices

Mouser Electronics Partners with Atmosic to Accelerate the Growth of Sustainable IoT Devices

Mouser Electronics Partners with Atmosic to Accelerate the Growth

Today Atmosic Technologies, an innovator in wireless energy harvesting platforms for the Internet of Things (IoT), and Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, announced a distribution partnership. Mouser will stock Atmosic’s portfolio of extremely low-power and energy-harvesting wireless Bluetooth® system-on-chips (SoCs) and evaluation kits.

Atmosic’s portfolio is designed with sustainability in mind, enabling developers to create connected devices that can use a single battery for a product’s entire lifespan; in some cases, these devices can even operate without any batteries. This extended battery life and battery-free operation is possible since Atmosic’s SoCs have the industry’s lowest power consumption. Additionally, Atmosic offers wireless solutions that can harvest energy from light, motion, thermal, and radio frequency (RF) sources. These energy harvesting solutions also support the new AirFuelRF™ wireless power specification, which uses RF technology to allow multiple devices to be charged and/or powered at the same time and from a distance.

“This distribution partnership is a big step forward for us to make our products more readily available, and thus make it easier for brands to bring to market sustainable wireless IoT products,” said Mike Fortin, Senior Vice President of Sales at Atmosic. “Mouser’s strong commitment to reducing their impact on the environment aligns well with our mission of reducing battery waste, so we look forward to working together to promote a greener IoT.”

Initially, Mouser’s inventory and website will feature Atmosic’s evaluation kits, as well as the ATM2 and ATM3 series of SoCs, with additional products to be introduced later in 2023. The company’s ATM2 and ATM3 SoCs combine an ultra-low power Bluetooth LE with an integrated power management unit. The ATM3 also adds intelligent management of energy harvesting sources to improve its efficiency and extend battery life or enable battery-free operation.

“Many well-known, tier-one consumer brands are already in high-volume production with Atmosic’s products, which is a testament to their commitments to sustainability and is also a great sign for designers looking to develop their own eco-friendly products,” said Andy Kerr, Vice President of Supplier Management at Mouser. “With Atmosic products now in stock at Mouser, IoT product developers around the world have immediate access to their extremely low-power wireless portfolio.”

Billions of batteries are being thrown away every year as the market for connected devices continues to grow. Atmosic’s innovative portfolio is working to solve this battery waste issue and help companies meet their sustainability goals. In addition to the environmental benefits of Atmosic’s solutions, extending battery life—or removing the need for batteries entirely—reduces maintenance time and costs for end-users.

About Atmosic Technologies

Atmosic™ Technologies is an innovative fabless semiconductor company, designing ultra-low power wireless and energy harvesting solutions to dramatically reduce and disrupt device dependency on batteries, aiming to deliver forever battery life and the battery-free connected Internet of Things. The company’s products enable the IoT device ecosystem—designers and manufacturers, as well as end users and those responsible for deployments—to dramatically lower costs and efforts associated with maintaining the growing Internet of Things in Personal, Home, Auto, Healthcare, Industrial, Enterprise and Smart Cities segments. In addition to these tangible business advantages, Atmosic aims to reduce ecological impacts with its vision of dramatically reducing battery consumption in the Internet of Things.

About Mouser

Mouser Electronics, a Berkshire Hathaway company, is an authorized semiconductor and electronic component distributor focused on New Product Introductions from its leading manufacturer partners. Serving the global electronic design engineer and buyer community, the global distributor’s website, mouser.com, is available in multiple languages and currencies and features more than 6.8 million products from over 1,200 manufacturer brands. Mouser offers 27 support locations worldwide to provide best-in-class customer service in the local language, currency, and time zone. The distributor ships to over 650,000 customers in 223 countries/territories from its 1 million-square-foot, state-of-the-art distribution facilities in the Dallas, Texas, metro area. For more information, visit https://www.mouser.com.

Spotlight

Spotlight

Related News

Industrial IoT

PTC Buys Pure-Systems, Boosts ALM Offerings in Regulated Industries

PTC | October 11, 2023

PTC is investing significantly in application lifecycle and software management acquisitions. Pure-Systems' pure::variants, has been implemented by several prominent manufacturing organizations worldwide. The acquisition aids in strengthening PTC's leadership in the application lifecycle management (ALM) domain. Software provider PTC has acquired Pure-Systems, a specialist in product and software variant management solutions, as part of its fourth acquisition for application lifecycle management (ALM) portfolio expansion. PTC, based in Boston, has been on an acquisition spree, spending around $1.8 billion on acquisitions in the last 18 months. This acquisition aims to enhance the capabilities of PTC's Codebeamer ALM solution. Manufacturing companies use pure-systems' solution, pure::variants, to manage software and systems engineering asset variations across product configurations. The addition of pure-systems will support PTC's position in the lead in the ALM market, drive additional ALM growth, and enhance relationships with customers in industries. Jim Heppelmann, Chairman and CEO of PTC, stated that the acquisition of pure-systems introduced essential functionality to their ALM suite, holding significant importance for manufacturers worldwide. He noted that manufacturers increasingly relied on software to distinguish their products and create various product versions to cater to a wide range of customer needs. In particular, automakers, heavily invested in software-defined vehicles, required tightly integrated ALM and software variant management solutions to effectively plan and deliver diverse software configurations for their array of vehicle offerings. Jim Heppelmann expressed the belief that the combination of Codebeamer and pure::variants positioned PTC as one of the leading providers of software requirements, configuration, testing, and validation solutions within the market. PTC's move reflects the growing trend among manufacturers to leverage software to differentiate products and cater to various customer needs. The acquisition is also designed to strengthen PTC's relationships with customers in regulated industries like aerospace, medical devices, and automotive manufacturing. Over the past year, PTC has acquired several companies, including ServiceMax, Intland Software, RE’FLEKT, and now Pure-Systems, to bolster its software management and ALM offerings. Danilo Beuche, CEO of pure-systems, stated, The pure-systems team is thrilled to join PTC and continues to support our manufacturing customers' needs for various software variant management solutions. PTC shares our focus on the critical needs for companies that make complex, regulated products and on the importance of an open ecosystem approach. We are proud of what the team of pure-systems has accomplished for our customers to this point, and we are excited to join PTC's ALM group to continue growing our position in this important market. [Source: CISION PR Newswire]

Read More

Industrial IoT

Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows

Business Wire | September 29, 2023

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard. The Integrity 3D-IC Platform is fully compliant with the 3Dblox 2.0 standard language extensions, and the flows have been optimized for all of TSMC’s latest 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS®) and System-on-Integrated-Chips (TSMC-SoIC®) technologies. Through this latest collaboration between Cadence and TSMC, customers creating AI, mobile, 5G, hyperscale computing and IoT 3D-IC designs can model system prototypes to accelerate design turnaround time. Prototyping requires two different types of feasibility-checking methods across the various 3DFabric technologies—coarse-grained feasibility for thermal and EM-IR analysis, and fine-grained feasibility for die-to-die connections. Coarse-grained feasibility is enabled through a system-level tool integration with the Integrity 3D-IC Platform, featuring Voltus™ IC Power Integrity Solution and Celsius™ Thermal Solver, providing seamless prototyping for all TSMC’s latest 3DFabric configurations. Fine-grained feasibility is enabled through a silicon routing solution as well as joint collaboration on the development of a next-generation auto-router for 3DFabric technologies, which includes performance-boosting prototyping capabilities that support TSMC’s InFO and CoWoS offerings, enabled through the Integrity 3D-IC platform. The Integrity 3D-IC platform is certified for use with TSMC’s 3DFabric and the 3Dblox 2.0 specification. The platform combines system planning, implementation and system-level analysis in a single platform, and due to the shared infrastructure between Cadence 3D design and system analysis tools, customers can perform feasibility-checking much more efficiently. In addition, Cadence Allegro® X packaging solutions have been enhanced with advanced InFO-specific design rule checking (DRC). The flows supporting the 3Dblox 2.0 standard provide chiplet mirroring, which lets engineers reuse chiplet module data, improving productivity and performance. In addition, the flows provide inter-chiplet DRC through the Cadence Pegasus™ Verification System, which helps designers create an inter-chiplet CAD layer for DRC automatically. With multiple packaging options available for implementation of multi-die designs, early prototyping and feasibility studies are becoming increasingly important, said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. Through our continued collaboration with Cadence and with the addition of the latest prototyping features that support the 3Dblox 2.0 standard, we’re enabling customers to leverage our comprehensive 3DFabric technologies and the Cadence flows to significantly improve 3D-IC design productivity and time to market. “The Cadence Integrity 3D-IC Platform is the unified solution that provides an efficient way for customers to leverage the new 3Dblox 2.0 prototyping capabilities to create leading-edge 3D-IC designs using TSMC’s 3DFabric technologies,” said Dr. Chin-Chi Teng, senior vice president and general manager in the Digital & Signoff Group at Cadence. “By working closely with TSMC, customers adopting our new flows for use with 3Dblox 2.0 standard can accelerate the pace of innovation with next-generation multi-chiplet designs.” The Cadence Integrity 3D-IC Platform includes Allegro X packaging technologies and is part of the company’s broader 3D-IC offering. The offering aligns with the Cadence Intelligent System Design™ strategy, enabling customers to achieve system-in-package (SiP) design excellence. For more information on the Integrity 3D-IC platform, please visit www.cadence.com/go/integrity3dblox2.

Read More

Enterprise Iot

UL Solutions Announces the Smart Systems Rating Program's First Verified Platinum Rating for the SIBCA Connect Platform

PR Newswire | October 16, 2023

UL Solutions, a global leader in applied safety science, today announced it issued the first Smart System Verified Platinum rating for the SIBCA Connect: Internet of Things (IoT) Platform. SIBCA is a provider of fire, life safety, and information and communication technology (ICT) solutions. "With our Smart Systems Rating Program, UL Solutions is helping the industry navigate the growing complexity of smart building systems and solidify the definition of a smart product based on features and best practices," said Sudhi Sinha, vice president of Ecosystems and Service Development at UL Solutions. "UL Solutions is pleased to announce that SIBCA has earned the Smart System Verified Platinum rating for their SIBCA Connect IoT Platform. Our Smart Systems Rating, a UL Marketing Claim Verification, helps our customers deliver confidence and peace of mind to buyers and consumers during their decision-making process, which helps them elevate their brand above competitors that self-declare their claims." UL Solutions evaluated the SIBCA Connect platform using UL MCV 1587, Methodology for Marketing Claim Verification: Smart System Verified to level Silver/Gold/Platinum/Diamond. This assessment — along with evidence from SIBCA — enabled UL Solutions to verify SIBCA's marketing claim about its product. UL Solutions Smart Systems Rating Program enabled us to demonstrate the level of our SIBCA Connect IoT Platform's smart system claim and differentiate our solution in a competitive and challenging market. We are honored to achieve the first Smart System Verified Platinum rating for our SIBCA Connect platform and be part of this industry-first program, said Ibrahim Lari, chairman and CEO of SIBCA. UL Solutions evaluates building systems and products according to the Smart System Rating Program across six categories: connectivity and interoperability, control and automation, digital experience, functional value, resiliency and cybersecurity. This assessment is performed based on the specifications published in UL MCV 1587. Each category has different areas of examination reflected in sub-categories, and the examination utilizes science-based methodology against these criteria and the published specification.

Read More