Thinfilm receives funding to help create open source IoT Platform

Thin Film Electronics (Thinfilm) has been awarded a grant from the European Commission to help fund the TagItSmart project, through which the printed electronics specialist will partner with global technology, consumer packaged goods and smart products companies to create the world’s first Internet of Things (IoT) platform featuring open source, open API architecture. Partners involved in the TagItSmart project include Siemens, Unilever, Evrythng, VTT and the University of Surrey, as well as Thinfilm.
The focus of TagItSmart will be to create a global-scale IoT platform – built using open source architecture – to support trillions of intelligent items and the data they generate. The platform will provide compelling functionality and full interoperability in order to seamlessly integrate with a vast array of IoT-centric tools, technologies and software.

The ultimate aim of TagItSmart is to help organizations effectively address challenges regarding the management of IoT products and related services as they seek to capitalize on the growing ‘sensorization’ of objects. TagItSmart will deliver a range of functional capabilities, including  the creation of smart markers using NFC or functional codes, the secure acquisition and consumption of contextual data, and the efficient creation and deployment of IoT-based services. To boost platform adoption, a set of industrial use cases will be identified and demonstrated.