Murata and Truphone Collaborate to Enable eSim in Low Power Cellular Modules for IoT

Murata and Truphone have announced an industry changing collaboration to integrate their technologies and services in order to lead innovation in eSIM for Internet of Things (IoT) / Machine-to-Machine (M2M) devices. Using technology from STMicroelectronics and Truphone, Murata has built a low power cellular module for the world of IoT/M2M devices. Murata’s technology has a wide range of IoT applications and delivers a small, low-power cellular module that reduces power consumption—making it ideal for battery-powered devices, lowering the cost of prod3uction, and freeing up space for device makers. The Murata module uses an ST33 M2M eSIM from ST, which offers a fully compliant GSMA solution for M2M remote SIM provisioning. The eSIM comes in a Wafer Level Chip Scale Package (WLCSP), a tiny package that allows the module to be smaller, less obtrusive and better integrated into whatever environment it may be operating in.

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