Annual PKI and IoT Trends Study finds Unprecedented Levels of PKI Challenges, Changes and Uncertainty in 2020

Entrust | October 13, 2020

Organizations are rapidly increasing the size, scope and scale of their data protection infrastructure, reflected in dramatic rises in adoption of public key infrastructure (PKI) across enterprises worldwide, according to new research from Entrust. PKI is at the core of nearly every IT infrastructure, enabling security for critical digital initiatives such as cloud, mobile device deployment, identities and the internet of things (IoT).

The annual 2020 Global PKI and IoT Trends Study, conducted by research firm the Ponemon Institute and sponsored by nCipher Security, an Entrust company, is based on feedback from more than 1,900 IT security professionals in 17 countries.

Spotlight

Mobile technology has a significant impact on the lives of more than 5 billion people around the world, and the GSMA is dedicated to connecting everyone and everything to a better future. The Internet of Things plays a vital role in creating this better future. From extreme wildlife tracking to protect species, to air and water quality monitoring for a cleaner environment, to smart traffic and crowd management for safer and more efficient cities, use cases for IoT solutions are near endless and the industries set to benefit from the IoT almost countless. With 30 billion connected devices by 2026, the Internet of Things will be essential in protecting the environment, building smarter and sustainable cities, and improving quality life for billions of citizens. In short, the Internet of Things will be essential in creating not only a better future, but a future that is connected, secure.


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ENTERPRISE IOT

New Digi ConnectCore MP1 Family of System-On-Modules Extends Digi’s IoT Solutions for Medical, Transportation and Industrial Sectors

Digi | June 23, 2022

Digi International, a leading global provider of Internet of Things (IoT) solutions, connectivity products and services, today extended its IoT solution portfolio with the unveiling of its new Digi ConnectCore® MP1 family of system-on-modules (SOMs). The MP1 is the industry’s smallest STM32MP1 SOM that integrates Wi-Fi, Bluetooth and wired connectivity without comprising design flexibility. This solution is made complete with its Connected Device platform as well as its well-tested development tools and design support. This makes Digi ConnectCore MP1 SOMs a cost-effective wireless solution for original equipment manufacturers (OEMs) seeking to reduce risk and effort in their product development. Ideal Digi ConnectCore MP1 applications include handheld products with cameras and/or displays such as medical devices, environmental test equipment, industrial human machine interfaces, or headless devices such as EV charging stations, renewable-energy controllers and others. Leveraging both new and market-proven STM32MP1 micro processing units (MPUs) from STMicroelectronics (STM), Digi ConnectCore MP1 SOMs offer more features with a lower total cost of ownership. The form factor is smaller than a postage stamp (29x29 mm), which is ideal for form-factor-challenged applications with low-profile requirements. These off-the-shelf family of Digi ConnectCore MP1 SOMs bring scalability, compatibility and pre-certified wireless connectivity in a solution suitable for a broad range of applications in the healthcare, transportation and industrial sectors. The unique Digi SMTplus™ surface-mount form factor provides design flexibility by enabling more complex applications through land grid array (LGA) pads and less complex applications using edge-castellated pads. By eliminating the need for connectors, ConnectCore SOMs shrink the bill of materials and offer greater suitability for high-vibration and harsh environment applications where connectors are prohibitive. Small Form Factor Packed with High-Performance Features STM32MP15x, single/dual Cortex-A7 @ 650 MHz Cortex-M4 companion processing core for real-time tasks (STM32MP15x only) Pre-certified Wi-Fi 5 802.11a/b/g/n/ac + Bluetooth 5.0 (including DLE) option Up to 1 GB SLC NAND flash, up to 1 GB DDR3 Unique ultra-low power and wake-up state management Dual 10/100/1000 Ethernet connectivity (single 10/100/1000 Eth for STM32MP15x) Fully validated embedded Linux software platform (Digi Embedded Yocto) Digi TrustFence® embedded security framework – ready-to-use security features Off-the-shelf development board and low-cost gateway reference design Industrial reliability and operating temperature with leading hardware warranty “Digi ConnectCore MP1 SOMs respond to the challenge of building intelligent, connected and secure wireless products in strongly regulated markets such as the healthcare, transportation, and industrial sectors, Unlike other SOMs, Digi ConnectCore MP1 provides a scalable, highly integrated solution that encompasses a complete set of development tools, design support, software, and security building blocks to accelerate time to market. Digi also provides remote management and security services to simplify deployment and ongoing maintenance throughout the entire product lifecycle.” Andreas Burghart, Senior Product Manager with Digi About Digi International Digi International is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting.

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INDUSTRIAL IOT

Telit Opens New Corporate Headquarters in California to Serve Rapidly Growing Market and Key Customers

Telit | June 15, 2022

Telit, a global enabler of the Internet of Things (IoT), today announced a new global corporate headquarters in Southern California. Following the CEO's move to the U.S., the new headquarters is in the City of Irvine Orange County's technology hub and will support Telit's strategy to grow its connected devices and solutions business worldwide. The Irvine office will also serve key projects and customers in the region, widening its U.S. presence that currently includes offices in Illinois, Florida and North Carolina. "These are exciting times for Telit, Choosing a global headquarters in California is a move consistent with the objective of strengthening our market position as a leading western player in the IoT connected devices and solutions arena. Particularly now with a 100% Western shareholder structure it's a move that poises Telit for major growth and expansion in 2022 and beyond." Paolo Dal Pino, CEO, Telit Today, Telit's headquarters, research and development centers, and sales and operations offices continue to expand globally, with 28 locations on six of the seven continents which include R&D centers in the U.S., Italy, Korea and India. As a driver enabling Industry 4.0. and digital transformation, Telit provides enterprises with best-in-class device management and connectivity solutions that are essential to technologies powering smart cities, transportation, manufacturing, automotive, retail, healthcare and beyond. Telit's IoT experts renowned for pioneering a successful end-to-end system approach ensure Telit modules, connectivity and platforms all work seamlessly together to scale IoT deployments today and in the future. In addition to implementing thousands of successful IoT solutions worldwide, Telit continues to invest in its technology roadmap to push the industry forward for years to come. About Telit Telit simplifies onboarding of connected 'things' with a portfolio of enterprise-grade wireless communication and positioning modules; cellular MVNO connectivity plans and management services; edge and cloud software; and data orchestration, IoT and Industrial IoT platforms. With over two decades of pioneering IoT innovation experience, Telit delivers award-winning, secure, integrated IoT solutions for many of the world's largest enterprises, OEMs, system integrators and service providers, so they can connect and manage IoT at any scale.

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INDUSTRIAL IOT

Quectel Launches Connectivity-as-a-Service and Integrated SIM to Simplify IoT Deployments in Asia Pacific

Quectel | June 29, 2022

Quectel Wireless Solutions, a global IoT solutions provider, is continuing to build on the successful EMEA roll-out of its Connectivity-as-a-Service (CaaS) and is now launching global connectivity sales in the Asia Pacific region. This new launch complements Quectel’s heritage of providing innovative modules and antennas to support cellular applications and allows customers to simplify their edge-based deployments by purchasing SIM cards and connectivity management alongside modules, antennas and design services. Adding connectivity broadens the Company’s portfolio and helps its customers to simplify the journey of designing, building, connecting and commercializing their IoT offerings. Quectel connectivity is available now in more than 190 countries via over 500 network operators, and currently provides 2G, 3G, 4G, NB-IoT and Cat-M connections. Connectivity from Quectel is available to the whole market and will particularly benefit deployments that can realize accelerated time-to-market and optimized business efficiencies from using a single supplier for module, antenna and connectivity. Embedded and integrated SIM (eSIM and iSIM) offerings are now entering mainstream adoption, and Quectel has recently launched the new BG773A-GL ultra-compact LTE Cat M1, NB1 and NB2 module which offers integrated SIM (iSIM) support. The iSIM capability of this new module provides huge flexibility and simplicity for integrators and IoT service providers, simplifying customer deployments which previously would have needed to have a local-market traditional SIM card installed and managed. With an eSIM or iSIM enabled module plus Quectel connectivity, the module, once powered up, will attach to the best available network. “Quectel connectivity is built on the backbone of service, quality and reliability, backed by Tier 1 providers and robust service level agreements (SLAs),” said Richard Hart, the Director of Global Connectivity at Quectel. “Our focus is on providing commercial flexibility for our customers to ensure they receive high quality connectivity that enables their IoT solutions regardless of where they are located in the world. Using self-optimizing tariffs, we can minimize the risk of additional charges when issues such as over-the-air (OTA) software updates utilize extra bandwidth and therefore prevent bill shock.” Alongside its long-standing global expertise in modules and antennas, Quectel also has significant experience in connectivity, having developed its QuecConnectivity platform that already manages more than 30 million SIMs in Asia. “Our module and antenna offering can now be combined with Connectivity-as-a-Service providing customers a single point of entry to Quectel’s full portfolio of products and services,” said Michael Wallon, VP Sales, APAC & ANZ. “By adding connectivity to our capabilities, Quectel is reducing complexity for our customers by simplifying and accelerating IoT device deployment, Quectel is committed to innovation that drives benefits for customers in the IoT industry, and our connectivity launch in the Asia Pacific region is another milestone in that journey. Quectel has helped IoT companies build a smarter world for more than a decade, now we will also connect a smarter world.” Patrick Qian, the Chief Executive Officer of Quectel About Quectel Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of over 4,000 professionals sets the pace for innovation in cellular, GNSS and WiFi/BT modules, antennas and IoT connectivity. Listed on the Shanghai Stock Exchange (603236.SS), our international leadership is devoted to advancing IoT across the globe.

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ENTERPRISE IOT

Renesas Delivers Industry’s Most Complete Intelligent Sensor Solutions for IoT Applications

Renesas | June 27, 2022

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, is changing the way designers build sensor-connected IoT applications with a range of new solutions targeted at faster design cycles, improved accuracy, and reduced system cost. In addition to the new HS4XXX family of relative humidity and temperature sensors, Renesas is introducing the ZSSC3281 sensor signal conditioning (SSC) IC for highly accurate amplification, digitization, and sensor-specific correction of sensor signals. These new products complement Renesas’ extensive MCU portfolio and embedded AI solutions. The sensor design process is supported by Renesas’ unique system design platform that significantly eases the prototyping of IoT systems. The Renesas Quick-Connect IoT system consists of standardized boards and interfaces, enabling designers to quickly and easily connect a wide range of sensors to MCU/MPU development boards. The new system also delivers core software building blocks that are portable between boards, greatly reducing coding requirements. Now, instead of writing and testing hundreds of lines of driver code, designers only need to graphically select their sensor and write a few lines of code. All the integration and setup effort happen behind the scenes, reducing the time to a working solution. Renesas also provides numerous Winning Combinations that combine sensors with multiple other ICs to offer customers an elevated design platform that mitigates the design risks and reduces development time. According to a recent Zion Market Research study, the Global IoT sensors market is estimated to grow at a compound annual growth rate (CAGR) of approximately 27.9%, reaching an estimated $27.9 billion by the year 2028. “Sensing solutions are a critical element in IoT systems, and present numerous design challenges during system integration that can slow development and impact overall system performance, The combination of our sensor technology, signal conditioning expertise, and system solution mindset enables us to deliver customers a design platform that is unmatched by any competitor.” DK Singh, Senior Director of the Systems and Solutions Team at Renesas With more than 20 years’ experience, Renesas has deep and broad expertise in the sensor market. Renesas’ portfolio includes sensor signal conditioners, biosensors, humidity and temperature sensors, light and proximity sensors, flow sensors, and position sensors. HS4XXX Relative Humidity and Temperature Sensors The new HS4XXX family of relative humidity and temperature sensors provides high accuracy, fast measurement response time, and ultra-low power consumption in a small package size, making them ideal for a wide number of applications ranging from portable devices to products designed for harsh environments. More information on the new family is available at renesas.com/humidity. Key features of the HS4XXX Relative Humidity and Temperature Sensors Very low current consumption: 0.3µA average for 8-bit resolution with a 3.3V supply Ultra-low sleep current: 0.010 µA Small 2.5 × 2.5 × 0.9 mm DFN-style 8-LGA package Highly accurate relative humidity sensing of ± 1.5% RH Temperature sensor accuracy of ±0.2°C typical ZSSC3281 Sensor Signal Conditioning IC The new ZSSC3281 SSC delivers highly accurate amplification, digitization, and sensor-specific correction of sensor signals. It includes a two-channel analog front end as well as an integrated ARM-based MCU with embedded mathematics for sensor signal processing. It targets high-end applications including industrial, medical and consumer sensing. Key features of the ZSSC3281 Sensor Signal Conditioning IC Highest performance with flexible analog front-end configurations Dual-speed mode for highest accuracy combined with fastest update rate 2 ADC’s running in parallel with up to 24-bit resolution Enables broad use for different sensor elements with multiple characteristics Measurement scheduler for optimized performance Advanced interrupt and diagnostic functions Digital interfaces including I²C, SPI, and One Wire Interface (OWI) 4-20mA current loop output, OWI communication via current loop About Renesas Electronics Corporation Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.

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Spotlight

Mobile technology has a significant impact on the lives of more than 5 billion people around the world, and the GSMA is dedicated to connecting everyone and everything to a better future. The Internet of Things plays a vital role in creating this better future. From extreme wildlife tracking to protect species, to air and water quality monitoring for a cleaner environment, to smart traffic and crowd management for safer and more efficient cities, use cases for IoT solutions are near endless and the industries set to benefit from the IoT almost countless. With 30 billion connected devices by 2026, the Internet of Things will be essential in protecting the environment, building smarter and sustainable cities, and improving quality life for billions of citizens. In short, the Internet of Things will be essential in creating not only a better future, but a future that is connected, secure.

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