MicroEJ | July 01, 2022
MicroEJ, leading provider of software containers for IoT and embedded devices, today announced the availability of Android Compatibility Kit, connecting global electronic things manufacturers to a fast-growing ecosystem of Android Studio and associated developers.
This new release consolidates MicroEJ’s positioning as the “tiny sibling of Android” for small and constrained smart devices. By enabling the same software to run on either MicroEJ or Android execution environment, manufacturers can easily switch from a powerful processor to a smaller one (from ex.: Arm Cortex-A to Arm Cortex-M) to dramatically reduce energy consumption.
MicroEJ Android Compatibility Kit brings many great benefits to smart devices manufacturers:
Android Compatibility and Android Studio Support
MICROEJ VEE share the same technology principles as Android. It now also supports the development of applications with Android Studio and integrates with the Gradle build system.
Accelerated Development using Virtual Devices
MicroEJ enables development on virtual devices to parallelize hardware and software development and speed up specification validation. Android Studio can launch MicroEJ Virtual Devices just as Android Virtual Devices.
Greater Energy Efficiency
MicroEJ Android Compatibility Kit enables two processors to coexist and distribute same tasks between a very powerful processor powered by Android and a low-power processor powered by MicroEJ to dramatically reduce energy consumption.
Leveraging Hardware Innovation by removing Software-Hardware Inter-lock
By using standard software containers, application code built with MicroEJ is portable on the best hardware, independently from RTOS/OS combinations. It accelerates hardware evaluations and fosters the development of derivative products thanks to software API reuse.
Large Developer Ecosystem
The large ecosystem of Java/Kotlin developers can now use popular tools such as IntelliJ IDEA, Android Studio and Gradle to build MicroEJ applications, leveraging low-power features embedded at the heart of MICROEJ VEE for highly optimized resources usage.
Leveraging Hardware IP’s for vector graphics
MICROEJ VEE eases the usage of Graphic Processing Units (GPU), enabling a similar look and feel as smartphone apps. MicroVG provides support for Android Vector Drawables and SVG formats for impeccable UI/UX on any type of screen and leverages any vector GPU when necessary.
The MicroEJ Android Compatibility Kit is especially valuable in battery-operated industries such as smartwatches and thermostats, allowing the development of cost-optimized and energy-efficient products. MicroEJ is a lightweight option that enables to expand product lines with the same user experience from low-end to premium devices.
“With this new offering from MicroEJ, developers can utilize processor capabilities while minimizing software development costs. This is of great value to our customers, particularly for those who build multiple product families using the breadth of our advanced portfolio of secure and energy efficient embedded processors from MCUs, to crossover i.MX RT and i.MX applications processors. For example, our recent collaboration with MicroEJ to enable the i.MX RT500 crossover MCU has been highly successful in simplifying access to its unique architecture of low-power and graphics. It’s a win-win for our customers.”
Said Joe Yu, Vice President and General Manager, IoT Edge Processing Line, NXP® Semiconductors.
“We are proud to release Android Compatibility Kit to enable the vast community of Android developers to design Android compatible applications for microcontrollers and small, low-power microprocessors. With this new release, MicroEJ is reinforcing its leading position on the smart things market for its global, easy-to-use and secure MICROEJ VEE application container, which provides a modern development process for any kind of software-enabled electronic project.”
Said Dr. Fred Rivard, MicroEJ’s CEO.
Android Compatibility Kit is currently successfully used with lead customers for the production of mass-market electronic products. Visit Android Compatibility Kit webpage to stay tuned.
MicroEJ is bringing container virtualization to IoT and embedded devices. We are focused on providing device manufacturers with secure application containers in markets where software applications require high performance, compact size, energy efficiency, and cost-effective development.
With over 100 million products sold, all the leading global manufacturers have chosen MicroEJ to design their electronic devices for a large variety of industries, including smart home, wearables, healthcare, industrial automation, retail, telecommunications, smart city, building automation, transportation, etc.
Quectel | June 29, 2022
Quectel Wireless Solutions, a global IoT solutions provider, is continuing to build on the successful EMEA roll-out of its Connectivity-as-a-Service (CaaS) and is now launching global connectivity sales in the Asia Pacific region. This new launch complements Quectel’s heritage of providing innovative modules and antennas to support cellular applications and allows customers to simplify their edge-based deployments by purchasing SIM cards and connectivity management alongside modules, antennas and design services. Adding connectivity broadens the Company’s portfolio and helps its customers to simplify the journey of designing, building, connecting and commercializing their IoT offerings.
Quectel connectivity is available now in more than 190 countries via over 500 network operators, and currently provides 2G, 3G, 4G, NB-IoT and Cat-M connections. Connectivity from Quectel is available to the whole market and will particularly benefit deployments that can realize accelerated time-to-market and optimized business efficiencies from using a single supplier for module, antenna and connectivity.
Embedded and integrated SIM (eSIM and iSIM) offerings are now entering mainstream adoption, and Quectel has recently launched the new BG773A-GL ultra-compact LTE Cat M1, NB1 and NB2 module which offers integrated SIM (iSIM) support. The iSIM capability of this new module provides huge flexibility and simplicity for integrators and IoT service providers, simplifying customer deployments which previously would have needed to have a local-market traditional SIM card installed and managed. With an eSIM or iSIM enabled module plus Quectel connectivity, the module, once powered up, will attach to the best available network.
“Quectel connectivity is built on the backbone of service, quality and reliability, backed by Tier 1 providers and robust service level agreements (SLAs),” said Richard Hart, the Director of Global Connectivity at Quectel. “Our focus is on providing commercial flexibility for our customers to ensure they receive high quality connectivity that enables their IoT solutions regardless of where they are located in the world. Using self-optimizing tariffs, we can minimize the risk of additional charges when issues such as over-the-air (OTA) software updates utilize extra bandwidth and therefore prevent bill shock.”
Alongside its long-standing global expertise in modules and antennas, Quectel also has significant experience in connectivity, having developed its QuecConnectivity platform that already manages more than 30 million SIMs in Asia. “Our module and antenna offering can now be combined with Connectivity-as-a-Service providing customers a single point of entry to Quectel’s full portfolio of products and services,” said Michael Wallon, VP Sales, APAC & ANZ.
“By adding connectivity to our capabilities, Quectel is reducing complexity for our customers by simplifying and accelerating IoT device deployment, Quectel is committed to innovation that drives benefits for customers in the IoT industry, and our connectivity launch in the Asia Pacific region is another milestone in that journey. Quectel has helped IoT companies build a smarter world for more than a decade, now we will also connect a smarter world.”
Patrick Qian, the Chief Executive Officer of Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of over 4,000 professionals sets the pace for innovation in cellular, GNSS and WiFi/BT modules, antennas and IoT connectivity. Listed on the Shanghai Stock Exchange (603236.SS), our international leadership is devoted to advancing IoT across the globe.
Ventev | August 10, 2022
Ventev, a division of TESSCO Technologies, Inc. a leading value-added distributor and solutions provider for the wireless industry, announced the launch of its new Universal Broadband Enclosure. This compact, modular, and lightweight solution powers, protects, and enables reliable backup for radio and networking equipment in harsh environments.
The Universal Broadband Enclosure is the latest addition to Ventev’s Power Systems product line. Its compact design offers an ideal fit for locations where aesthetics and footprint are important. This NEMA 3R rated enclosure is designed to power and protect in harsh conditions, including outside plant environments.
The Universal Broadband Enclosure is engineered for industrial networking switches and routers, edge computer devices low-to medium-power, remote radio heads, and other wireless system elements. It comes standard with a pre-installed, hot swap 48VDC rectifier that is expandable up to 1400W with the option of adding battery strings to an isolated battery box. The lightweight powder-coated aluminum construction also offers superior corrosion-resistant properties.
“Ventev’s Universal Broadband Enclosure features a factory pre-wired and integrated system designed to cut down on installation time and deployment costs, as well as reduces the risk of field wiring errors, The various mounting options make this highly versatile solution ideal for critical broadband, Industrial IoT (IIoT), and edge mobile data applications.”
Thad Lowe, General Manager of Ventev
Ventev, a division of TESSCO Technologies Inc., designs and manufactures industry-leading Wi-Fi and wireless infrastructure products, to ensure reliable network performance and simplify the installation of Wi-Fi, IoT, LTE, DAS, and two-way networks. After you choose the radio, choose Ventev to connect, protect, and enable your wireless radio network.
About TESSCO Technologies Incorporated
TESSCO Technologies, Inc. (NASDAQ: TESS) is a value-added technology distributor, manufacturer, and solutions provider serving commercial customers in the wireless infrastructure ecosystem. The Company was founded more than 30 years ago with a commitment to deliver industry-leading products, knowledge, solutions, and customer service. Tessco supplies more than 65,000 products from 250 of the industry’s top manufacturers in mobile communications, Wi-Fi, Internet of Things (“IoT”), wireless backhaul, and more. Tessco is a single source for outstanding customer experience, expert knowledge, and complete end-to-end solutions for the wireless industry.
Kontron | June 14, 2022
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), and Inflight Entertainment and Connectivity (IFE&C) solutions, today announced FAA PMA approval and general availability of the latest generation of Cab-n-Connect™ Wireless Access Points based on Wi-Fi 6.
The Cab-n-Connect™ A200 provides a backwards compatible version to Kontron’s previous generation Cab-n-Connect™ CWAPs and allows airlines to easily upgrade their existing CWAPs without changing any wiring on the aircraft. The Cab-n-Connect™ A201 provides a version that meets the ARINC 628 CWAP standard which utilizes a different connector interface and is preferred for linefit installations. The A200 product received FAA PMA approval earlier this year and the Cab-n-Connect™ A201 is expected to have PMA approval by Q3 2022.
Both products use the same Extreme WiNG Enterprise WAP engine which provides the highest level of efficiency and performance based on 802.11ax Wi-Fi 6 technology, optimized for video streaming in dense multi-client environments within the aircraft cabin and with a 3rd dedicated radio provides the highest level of security and monitoring along with intelligent edge capability.
The increased security features, efficiency improvements through new channel-sharing capabilities, and built-in intelligence at the edge significantly improves the passenger experience while giving operators and the airlines more control and options within their wireless network on the aircraft.
Kontron is an active member of Seamless Air Alliance and the Cab-n-Connect™ CWAP aligns with the features and requirements within the Seamless Release standards such as Hotspot 2.0.
About Kontron – Member of the S&T Group
Kontron is a global leader in IoT/Embedded Computing Technology (ECT). As part of the S&T technology group, Kontron offers individual solutions in the areas of Internet of Things (IoT) and Industry 4.0 through a combined portfolio of hardware, software and services. With its standard and customized products based on highly reliable state-of-the-art technologies, Kontron provides secure and innovative applications for a wide variety of industries. As a result, customers benefit from accelerated time-to-market, lower total cost of ownership, extended product lifecycles and the best fully integrated applications.