SOFTWARE AND TOOLS
Renesas | June 22, 2022
Renesas Electronics Corporation announced the SmartBond™ DA1470x Family of Bluetooth® low energy (LE) solutions the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity.
The DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU) and Bluetooth LE connectivity all into a single chip. This combined functionality provides smart IoT devices with the most advanced sensor and graphical capabilities and seamless, ultra-low-power, always-on audio processing. The new family is ideal for wearables like smartwatches and fitness trackers; glucose monitor readers and other consumer medical and healthcare devices; home appliances with displays; industrial automation and security systems; and Bluetooth consoles such as e-bikes and gaming equipment.
“The DA1470x family expands on our successful strategy of integrating more functions, including greater processing power, expanded memory and improved power modules, along with VAD for always-on wake and command word detection, This feature-packed SoC product family enables developers to push the boundaries of connected consumer and industrial applications and future-proof their IoT products to fit the needs of multiple applications, while optimizing their bill of materials.”
Sean McGrath, Vice President of the Connectivity and Audio Business Division in Renesas’ IoT, Industrial and Infrastructure Business Unit
The high level of integration further results in significant cost savings on the Bill of Materials (BoM), enabling cost-effective system solutions. It also reduces component count on the PCB enabling smaller form factor designs and freeing up space for additional components or larger batteries. With less components on the PCB, the reliability of the system is also improved, delivering a further reduction in the total cost of goods sold (COGS) of the end product.
The SmartBond DA1470x Family is already gaining acceptance in the market. For example, the DA14706 is at the heart of the newly launched Xiaomi Mi band 7 with an eye catching 1.62“, 192x490 AMOLED display, 120 sports modes and a 15-day battery life for typical use.
Key Features of the DA1470x Wireless SoCs
Multi core system – Arm® Cortex®-M33 processor as the main application core and Cortex -M0+ as the sensor node controller.
Integrated 2D GPU & Display controller supporting DPI, JDI parallel, DBI and Single/Dual/Quad SPI interfaces.
Configurable MAC supporting Bluetooth® LE 5.2 and proprietary 2.4 GHz protocols.
Integrated 720mA JEITA-compliant USB charger supports rechargeable Li-ion/Li-Po batteries.
Integrated low quiescent current SIMO DC/DC converter of the PMU efficiently supplies internal system and external components
Ultra-low power hardware VAD enables seamless and always on audio processing
Winning Combination
Renesas has combined the new DA1470x with multiple components from its broad range of embedded processing, analog, power and connectivity portfolio to create two new Winning Combinations: a Wearable Activity Tracker and an Instrument Panel for Light EVs and eBikes. Renesas offers more than 300 Winning Combinations with compatible devices from the Renesas product portfolio to enable customers to speed up the design process and bring products to market more quickly. They can be found at renesas.com/win.
Availability
The DA1470x Family consists of four new devices, all of which are in mass production and widely available now. More information about all the new devices is available at renesas.com/DA1470x.
About Renesas Electronics Corporation
Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
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ENTERPRISE IOT
Connectivity Standards Alliance | July 11, 2022
The Connectivity Standards Alliance, an organization consisting of hundreds of companies that create, maintain, and deliver open global standards for the Internet of Things (IoT), today celebrates 20 years of innovation and collaboration – driving the next generation of home and commercial network connectivity forward.
"The secret to success for our members has been creating the right environment where companies, both large and small, can work side-by-side with an equal voice and energy to address the barriers to interoperability and growth in the IoT," said Tobin Richardson, President, and CEO of the Alliance. "What began as cutting edge work to create Zigbee, our reliable mesh networking standard, has expanded to include our latest IoT standard Matter. This is joined by industry leading efforts in Data Model development, Access Control, and creating strong Product Security. The Alliance's growth and reach reflects a holistic approach to solving the challenges of an ever-evolving IoT."
As a global standards organization, our key measures of success are adoption, certification, and the use of the standards created. In 2021, our membership grew by 38%, with members evenly distributed across the Americas, EMEA, and China/Asia Pacific regions. Year-to-date in 2022, another 60 companies have chosen to participate in Alliance work and adopt Alliance standards. In-market use shows there are currently more than 4,500 products and platforms that have been certified by the Alliance, with millions of Zigbee-capable devices in the market today. This positive trajectory will continue with Zigbee and with Matter, where according to ABI Research, within five years more than half of the world's key smart home devices will ship supporting Matter*.
"Alliance standards have been invaluable to the growth of smart homes and buildings, enabling reliable mesh networking and low-power solutions, with Zigbee Green Power, to reduce customers' and consumers' carbon footprint. Now, we are driving what's next in IP-based interoperability and IoT security, Over 20 years, we've had a positive environmental impact on our planet. Our impact has now even traveled beyond the bounds of earth's gravity with NASA using Zigbee technology for communication between the Mars rover and its companion drone."
Bruno Vulcano, Head of R&D at Legrand and Chair of the Alliance Board of Directors
Looking ahead at the next two decades, the Alliance will continue its mission to simplify and harmonize the IoT by creating standards and brands of trust for the industry and consumers alike. This fall, the Alliance is slated to formally introduce its latest standard, Matter, a common language and IP-based protocol for the IoT. Products incorporating the Matter standard will feature a unique logo, signifying interoperability with certified Matter products from any manufacturer.
About the Connectivity Standards Alliance
The Connectivity Standards Alliance, formerly the Zigbee Alliance, is the foundation and future of the Internet of Things (IoT). Established in 2002, its wide-ranging global membership collaborates to create and evolve universal open standards for the products transforming the way we live, work and play. With its Members' deep and diverse expertise, robust certification programs, and a full suite of open IoT solutions the Alliance is leading the movement toward a more intuitive, imaginative, and useful world.
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SOFTWARE AND TOOLS
LF Edge | June 28, 2022
LF Edge, an umbrella organization under the Linux Foundation that aims to establish an open, interoperable framework for edge computing independent of hardware, silicon, cloud, or operating system, today announced continued ecosystem collaboration via a new collaborative white paper, "Sharpening the Edge II: Diving Deeper into the LF Edge Taxonomy & Projects."
A follow-up to the LF Edge community's original, collaborative 2020 paper – which provides an overview of the organization and details the LF Edge taxonomy, high level considerations for developing edge solutions and key use cases, – the new publication dives deeper into key areas of edge manageability, security, connectivity and analytics, and highlights how each project addresses these areas. The paper demonstrates maturation of the edge ecosystem and how the rapidly growing LF Edge community has made great progress over the past two years towards building an open, modular framework for edge computing. As with the first publication, the paper addresses a balance of interests spanning the cloud, telco, IT, OT, IoT, mobile, and consumer markets.
"With the growing edge computing infrastructure market set to be worth up to $800B by 2028, our LF Edge project communities are evolving, This paper outlines industry direction through an LF Edge community lens. With such a diverse set of knowledgeable stakeholders, the report is an accurate reflection of a unified approach to defining open edge computing."
Jason Shepherd, VP Ecosystem, ZEDEDA and former LF Edge Governing Board Chair
"I'm eager to continue to champion and spearhead the great work of the LF Edge community as the new board chair," said Tina Tsou, new Governing Board chair, LF Edge. "The Taxonomy white paper that demonstrates the accelerated community momentum seen by open source edge communities is really exciting and speaks to the power of open source."
The white paper, which is now available for download, was put together as the result of broad community collaboration, spanning insights and expertise from subject matter experts across LF Edge project communities: Akraino, EdgeX Foundry, EVE, Fledge, Open Horizon, State of the Edge, Alvarium, Baetyl, eKuiper, and FIDO Device Onboard.
ONE Summit North America 2022
Join the broader open source ecosystem spanning Networking, Edge, Access, Cloud and Core at ONE Summit North America, November 15-16 in Seattle, Wash. ONE Summit is the one industry event focused on best practices, technical challenges, and business opportunities facing decision makers across integrated verticals such as 5G, Cloud, Telco, and Enterprise Networking, as well as Edge, Access, IoT, and Core. The Call for Proposals is now open through July 8, 2022. Sponsorship opportunities are also available.
About The Linux Foundation
Founded in 2000, the Linux Foundation is supported by more than 1,000 members and is the world's leading home for collaboration on open source software, open standards, open data, and open hardware. Linux Foundation's projects are critical to the world's infrastructure including Linux, Kubernetes, Node.js, and more. The Linux Foundation's methodology focuses on leveraging best practices and addressing the needs of contributors, users and solution providers to create sustainable models for open collaboration.
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ENTERPRISE IOT
Renesas | June 27, 2022
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, is changing the way designers build sensor-connected IoT applications with a range of new solutions targeted at faster design cycles, improved accuracy, and reduced system cost.
In addition to the new HS4XXX family of relative humidity and temperature sensors, Renesas is introducing the ZSSC3281 sensor signal conditioning (SSC) IC for highly accurate amplification, digitization, and sensor-specific correction of sensor signals. These new products complement Renesas’ extensive MCU portfolio and embedded AI solutions.
The sensor design process is supported by Renesas’ unique system design platform that significantly eases the prototyping of IoT systems. The Renesas Quick-Connect IoT system consists of standardized boards and interfaces, enabling designers to quickly and easily connect a wide range of sensors to MCU/MPU development boards. The new system also delivers core software building blocks that are portable between boards, greatly reducing coding requirements. Now, instead of writing and testing hundreds of lines of driver code, designers only need to graphically select their sensor and write a few lines of code. All the integration and setup effort happen behind the scenes, reducing the time to a working solution.
Renesas also provides numerous Winning Combinations that combine sensors with multiple other ICs to offer customers an elevated design platform that mitigates the design risks and reduces development time.
According to a recent Zion Market Research study, the Global IoT sensors market is estimated to grow at a compound annual growth rate (CAGR) of approximately 27.9%, reaching an estimated $27.9 billion by the year 2028.
“Sensing solutions are a critical element in IoT systems, and present numerous design challenges during system integration that can slow development and impact overall system performance, The combination of our sensor technology, signal conditioning expertise, and system solution mindset enables us to deliver customers a design platform that is unmatched by any competitor.”
DK Singh, Senior Director of the Systems and Solutions Team at Renesas
With more than 20 years’ experience, Renesas has deep and broad expertise in the sensor market. Renesas’ portfolio includes sensor signal conditioners, biosensors, humidity and temperature sensors, light and proximity sensors, flow sensors, and position sensors.
HS4XXX Relative Humidity and Temperature Sensors
The new HS4XXX family of relative humidity and temperature sensors provides high accuracy, fast measurement response time, and ultra-low power consumption in a small package size, making them ideal for a wide number of applications ranging from portable devices to products designed for harsh environments. More information on the new family is available at renesas.com/humidity.
Key features of the HS4XXX Relative Humidity and Temperature Sensors
Very low current consumption: 0.3µA average for 8-bit resolution with a 3.3V supply
Ultra-low sleep current: 0.010 µA
Small 2.5 × 2.5 × 0.9 mm DFN-style 8-LGA package
Highly accurate relative humidity sensing of ± 1.5% RH
Temperature sensor accuracy of ±0.2°C typical
ZSSC3281 Sensor Signal Conditioning IC
The new ZSSC3281 SSC delivers highly accurate amplification, digitization, and sensor-specific correction of sensor signals. It includes a two-channel analog front end as well as an integrated ARM-based MCU with embedded mathematics for sensor signal processing. It targets high-end applications including industrial, medical and consumer sensing.
Key features of the ZSSC3281 Sensor Signal Conditioning IC
Highest performance with flexible analog front-end configurations
Dual-speed mode for highest accuracy combined with fastest update rate
2 ADC’s running in parallel with up to 24-bit resolution
Enables broad use for different sensor elements with multiple characteristics
Measurement scheduler for optimized performance
Advanced interrupt and diagnostic functions
Digital interfaces including I²C, SPI, and One Wire Interface (OWI)
4-20mA current loop output, OWI communication via current loop
About Renesas Electronics Corporation
Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
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