Winbond Electronics Corporation and Infineon Technologies, a worldwide leader in semiconductor, microelectronics, and IoT solutions, have announced the extension of their HYPERRAM product partnership with the new greater bandwidth HYPERRAM 3.0.
As a leading provider of memory solutions, Infineon provides a family of solutions that deliver high performance in smaller form factors for next-generation IoT applications. HYPERRAM™ 3.0 is the third generation of the HYPERRAM™ family that supports throughput of up to 800MBps using a new 16-bit extended version of the HyperBus™ interface. The 256Mb HYPERRAM™ 3.0 devices are now sampling. Infineon Technologies is pleased to collaborate with Winbond to enable broader adoption of this new memory technology,"
Ramesh Chettuvetty, Sr. Director of Marketing and Applications at Infineon Technologies.
The HYPERRAM product line provides low-power, space-constrained IoT applications that need an off-chip external RAM, a small alternative to standard pseudo-SRAM. HYPERRAM 3.0 has a maximum frequency of 200MHz and a 1.8V operating voltage, which is the same as HYPERRAM 2.0 and OCTAL xSPI RAM, but it has a data transfer rate of 800 MBps, which is twice the previous rate. In addition, the enlarged IO HyperBus interface with 22 pins is used by the latest generation HYPERRAM.
"Low pin count, low power consumption and easy control are three key features of HYPERRAM™ that help it significantly improve the performance of IoT end devices," says Winbond. "HYPERRAM™ significantly simplifies the PCB layout design, extends mobile devices' battery life, and works with a smaller processer via a lower pin count while increasing throughput compared to low-power DRAM, SDRAM, and CRAM/PSRAM," Winbond added.
New IoT devices conduct more than only machine-to-machine communication; they also take care of voice control and tinyML inferences that requires greater memory. Wearables, instrument clusters in automotive applications, infotainment and telematics systems, industrial machine vision, HMI displays, and communication modules are all good candidates for the HYPERRAM family. HYPERRAM 3.0 is a new version that can function with the same command/address signal and data bus structure as the previous generation but with increased bandwidth and lower standby power. The first device in the HYPERRAM 3.0 family will be a 256Mb device in a KGD, WLCSP package, which may be implemented at the component, module, or PCB level according to the final product type.