Internet of Things: Architecture, Protocols and Services

June 17, 2016

The Internet of Things was “Born” between 2008 and 2009, when the number of things connected to the Internet exceeded the number of people connected...

Spotlight

Terepac Corporation

Current methods for manufacturing electronics create products that are thick, heavy, rigid, and expensive, with a heavy environmental footprint. Terepac was founded in 2004 to commercialize breakthrough innovations which over­come these limitations through an entirely new paradigm for assembly, integration and packaging of electronic products. The company’s revolutionary technologies enable sophisticated microelectron­ics to be printed on flexible substrates at a fraction of the size and cost of creating conventional circuits. Entire devices with microprocessors, memory, and sensors can be reduced to less than a millimeter square, thinner than paper, and flexible enough to bend around a pencil – with no sacrifice in performance. As a result, these tiny electronics can be used in ways previously not thought physically or economically feasible. They also allow existing devices, components and products to be transformed into small, flexible forms which were previously impractical or even

OTHER WHITEPAPERS
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CYBER SECURITY IN THE ERA OF INDUSTRIAL IOT

whitePaper | February 6, 2020

Industrial cyber security has been a topic of much debate over the last decade. Despite the industry’s widespread acknowledgement of its significance, cyber security in the industry continues to be an elusive subject for many. A huge gap exists in understanding the implications of cyber security; however, the subject has been greatly discussed. Interestingly, the industrial environment is currently passing through a key phase, where the idea of Internet of Things (IoT) is beginning to pervade all areas of industrial operation. This ongoing change is poised to expand the complex security needs in the factories of the future.

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Fixed 5th Generation Advanced and Beyond

whitePaper | September 20, 2022

One of the overarching goals of the ETSI Industry Specification Group (ISG) F5G on Fifth Generation Fixed Network is to establish a regular rhythm of evolution for the fixed telecommunications network. This technology enhancement corresponds to the series of generations defined for the wireless network. So far, F5G has published technical specifications on use cases, generations definition of fibre networks, architecture, and more. As it continues, these documents will be enhanced and revised to describe the fifth generation of fixed networks more fully. Therefore, we need to consider the evolution of F5G. This White Paper describes the drivers, dimensions, and technologies of the F5G advanced and beyond.

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Tech Data Scaling IoT Solutions Whitepaper

whitePaper | July 6, 2022

The Intel, Microsoft and Tech Data strategic alliance is a compelling solution to keep this digital transformation moving forward. Key Stats. The remote asset The Intel, Microsoft and Tech Data strategic alliance is a compelling solution to keep this digital transformation moving forward.

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IoT at the Edge: HOW AI WILL TRANSFORM IOT ARCHITECTURE

whitePaper | May 23, 2021

The vast amounts of data constantly collected by the billions of sensors and devices that make up the Internet of Things (IoT) can pose a serious processing challenge for businesses that rely on traditional intelligence and analytics tools. An emerging solution is to use Artificial Intelligence (AI) and machine learning to build intelligent systems that automatically gather, process, and extract actionable insights from IoT data - in real time without the need for human intervention. How are AI-enabled systems transforming IoT devices and applications at the edge, and what are some of the emerging use cases we can expect to see in the near future?

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HOW TO ACHIEVE SUCCESS WITH THE IOT?

whitePaper | December 7, 2021

Achieving success with the Internet of Things (IoT)requires a lot more than just selecting the right technology. This helpful guide tackles the aspects of IoT implementation that companies wrestle with the most, such as creating a strong business case, managing security requirements, and identifying the top requirements of a successful system. We also take a deep dive into the most common challenges that early IoT adopters have encountered—from budget constraints to cultural resistance to change—with advice on how to overcome these challenges to obtain real and tangible benefits.

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5G The Future of IoT

whitePaper | November 1, 2019

The Internet of Things (IoT) is transforming businesses and peoples’ lives, and will continue to ignite innovations in the future. It is expected that we will progress to tens of billions of connected devices globally over the next decade1 that will generate multi-trillion dollars of economic value2 across many markets forming the foundation of a totally interconnected world—or the Internet of Everything.

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Spotlight

Terepac Corporation

Current methods for manufacturing electronics create products that are thick, heavy, rigid, and expensive, with a heavy environmental footprint. Terepac was founded in 2004 to commercialize breakthrough innovations which over­come these limitations through an entirely new paradigm for assembly, integration and packaging of electronic products. The company’s revolutionary technologies enable sophisticated microelectron­ics to be printed on flexible substrates at a fraction of the size and cost of creating conventional circuits. Entire devices with microprocessors, memory, and sensors can be reduced to less than a millimeter square, thinner than paper, and flexible enough to bend around a pencil – with no sacrifice in performance. As a result, these tiny electronics can be used in ways previously not thought physically or economically feasible. They also allow existing devices, components and products to be transformed into small, flexible forms which were previously impractical or even

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